IP Library Granted Patent US 7,768,083
Granted Patent B2
US 7,768,083 · App. 11/335,944 · Granted Aug 3, 2010

Arrangements for an integrated sensor

Assignee: Allegro Microsystems, Inc.
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Quick Facts
Patent No.
US 7,768,083
App. No.
11/335,944
Granted
Aug 3, 2010
Kind
B2
Abstract

An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Claims (34)

1. An integrated circuit, comprising:

a lead frame;

a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate;

a second substrate having first and second opposing surfaces, wherein the second substrate is coupled to the lead frame such that the second surface of the second substrate is above the lead frame and the first surface of the second substrate is above the second surface of the second substrate;

an electronic component disposed on the first surface of the first substrate;

a first magnetic field sensing element disposed on the first surface of the second substrate; and

a second magnetic field sensing element disposed on the first surface of the first substrate.

2. The integrated circuit of claim 1 , further including a flux concentrator disposed proximate to the magnetic field sensing element.

3. The integrated circuit of claim 1 , wherein the first substrate is comprised of a selected one of Si, GaAs, InP, InSb, InGaAs, InGaAsP, SiGe, ceramic, or glass and the second substrate is comprised of a selected one of Si, GaAs, InP, InSb, InGaAs, InGaAsP, SiGe, ceramic, or glass.

4. The integrated circuit of claim 1 , wherein the first surface of the second substrate is coupled to the first surface of the first substrate with a wire bond.

5. The integrated circuit of claim 4 , further including at least one flux concentrator disposed proximate to at least one of the magnetic field sensing element or the second magnetic field sensing element.

6. The integrated circuit of claim 1 , wherein the lead frame further comprises a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the second substrate, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

7. The integrated circuit of claim 1 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to a magnetic field generated by a current passing through the conductor.

8. The integrated circuit of claim 1 , further comprising:

a current conductor disposed proximate to the second substrate; and

a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the lead frame and a second portion of the flux concentrator is disposed above the first surface of the second substrate.

9. The integrated circuit of claim 1 , further comprising a conductor, wherein the first and second magnetic field sensing elements are responsive to a magnetic field generated by a current carried by the conductor.

10. An integrated circuit, comprising:

a first magnetic field sensing element for providing a first sensitivity to a magnetic field;

a second magnetic field sensing element for providing a selected second different sensitivity to the magnetic field; and

a circuit coupled to the first and second magnetic field sensing elements, operable to provide the integrated circuit with a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element.

11. The integrated circuit of claim 10 , wherein the first magnetic field sensing element and the second magnetic field sensing element are Hall effect elements.

12. The integrated circuit of claim 10 , wherein the first magnetic field sensing element and the second magnetic field sensing element are magnetoresistance elements.

13. The integrated circuit of claim 10 , wherein the first magnetic field sensing element is a Hall effect element and the second magnetic field sensing element is a magnetoresistance element.

14. The integrated circuit of claim 10 , further comprising a lead frame having a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the first and second magnetic field sensing elements, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

15. The integrated circuit of claim 10 , further comprising a conductor, wherein the magnetic field is generated by a current carried by the conductor.

16. An integrated circuit, comprising:

a first substrate;

a circuit element disposed on a surface of the first substrate;

a Hall effect element disposed on a surface of the first substrate, wherein the Hall effect element provides a first sensitivity to a magnetic field;

a second substrate coupled to the first substrate, and

a magnetoresistance element disposed on a surface of the second substrate, wherein the magnetoresistance element provides a selected second different sensitivity to the magnetic field, resulting in the integrated circuit having a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element.

17. The integrated circuit of claim 16 , wherein the first substrate is comprised of a selected one of Si, GaAs, InP, InSb, InGaAs, InGaAsP, SiGe, ceramic, or glass and the second substrate is comprised of a selected one of Si, GaAs, InP, InSb, InGaAsP, SiGe, ceramic, or glass.

18. The integrated circuit of claim 16 , further comprising a conductor, wherein the magnetic field is generated by a current carried by the conductor.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS AT REEL 053957/FRAME 0874 Recorded Nov 1, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 065420/0572 →
RELEASE OF SECURITY INTEREST IN PATENTS (R/F 053957/0620) Recorded Jun 22, 2023
From: MIZUHO BANK, LTD., AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 064068/0360 →
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 053957/0874 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: MIZUHO BANK LTD., AS COLLATERAL AGENT
Reel/Frame 053957/0620 →
CONVERSION AND NAME CHANGE Recorded Apr 10, 2013
From: ALLEGRO MICROSYSTEMS, INC.
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 030426/0178 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2006
From: DOOGUE, MICHAEL C.; TAYLOR, WILLIAM P.; MANGTANI, VIJAY
To: ALLEGRO MICROSYSTEMS, INC.
Reel/Frame 017502/0268 →
Continuity (1)
Related Publication 20070170533A1 · Jul 26, 2007