Memory card and method for fabricating the same
A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.
1. A method for fabricating a memory card, comprising:
providing a circuit board with a plurality of spacing arranged circuit board units, wherein each of the circuit board units has a predefined shape of a memory card and is connected to the circuit board through a connecting portion, and at least a chip is mounted to and electrically connected with each of the circuit board units;
attaching a thin film to a surface of the circuit board opposed to the surface mounted with the chips corresponding to the circuit board units;
covering the circuit board and the thin film with a mold so as to define mold cavities having same shape as the circuit board units but bigger size, and filling a packaging material in the mold cavities so as to form an encapsulant encapsulating the chips and outer sides of the circuit board units; and
removing the thin film and cutting away the connecting portions so as to obtain a plurality of memory cards having the predefined shape.
2. The method of claim 1 , wherein the chip is electrically connected to the circuit board unit by one of the methods consisting of flip chip and wire bonding.
3. The method of claim 1 , wherein the circuit board has a plurality of openings for separating the circuit board units.
4. The method of claim 1 , wherein each of the circuit board units has a first surface to be mounted with the chip, a second surface opposed to the first surface, and conductive through holes penetrating the first and second surfaces.
5. The method of claim 4 , wherein the first surface of the circuit board unit has circuit pattern connecting the conductive through holes, and the second surface of the circuit board unit has electrical terminals respectively connecting the conductive through holes.
6. The method of claim 1 , wherein the thin film is made of a heat resistant material.
7. The method of claim 1 , wherein the mold comprises a lower mold abutting against the thin film and an upper mold covering the circuit board and the thin film, by defining the mold cavities through the upper mold and the thin film, space for filling of the packaging material is limited, thereby preventing leakage of the packaging material.
8. The method of claim 1 , wherein the predefined shape of the memory card is an irregular shape.
9. The method of claim 1 , wherein the connecting portion is a connecting bar.
10. The method of claim 1 , wherein the plurality of circuit board units of the circuit board is arranged in a single row, each of the circuit board units is connected to the circuit board through a connecting portion and the circuit board units are spaced from each other by openings.
11. The method of claim 1 , wherein the plurality of circuit board units of the circuit board is arranged in a plurality of rows, the circuit board units in a same row are spaced from each other by openings, and the circuit board units in different rows are connected with each other through connecting portions.
12. The method of claim 1 , further comprising forming a chamfer at one side of each of the circuit board units so as to obtain memory card having the predefined shape and chamfer.
13. The method of claim 12 , wherein the step of forming the chamfer is performed after the encapsulant is formed.
14. The method of claim 12 , wherein the step of forming the chamfer is performed before the thin film is removed and the connecting portions are cut away.
15. The method of claim 1 , wherein the memory card is a card type package selected from the group consisting of Micro-SD, MMC-Micro and Memory Stick Micro (M2).