Semiconductor device and method for manufacturing the same
A semiconductor device and a method for manufacturing the same includes forming a poly-gate including a first poly-gate portion and a second poly-gate portion on and/or over a semiconductor substrate, forming a trench having a predetermined depth in the poly-gate, implanting dopant ions into the entire surface of the semiconductor substrate and the poly-gate including the trench, forming a contact barrier layer to cover a portion of the poly-gate including the trench while exposing an upper surface of the remaining portion of the poly-gate on which a contact will be formed, and forming a contact on the exposed upper surface of the poly-gate.
1. A method for manufacturing a semiconductor device comprising:
forming a poly-gate having a first poly-gate portion and a second poly-gate portion over a semiconductor substrate; and then
forming a photosensitive layer over the entire surface of the semiconductor substrate including the second poly-gate portion; and then
forming photosensitive layer patterns to expose only the second poly-gate portion; and then
forming a trench at a predetermined depth in the second poly-gate portion bar etching the poly-gate using the photosensitive layer patterns as etching masks; and then
removing the photosensitive layer patterns; and then
implanting dopant ions into the entire surface of the semiconductor substrate and the poly-gate including the trench; and then
forming a contact barrier layer over the second poly-gate portion including the trench while exposing an upper surface of the first poly-gate portion; and then
forming a contact over the exposed upper surface of the first poly-gate portion.
2. The method of claim 1 , further comprising:
forming a lightly doped drain region by implanting ions into the surface of the semiconductor substrate using the poly-gate as a mask; and then
forming a spacer at opposite sidewalls of the poly-gate; and then
forming a silicide layer over the entire surface of the poly-gate including the trench.
3. The method of claim 2 , further comprising, before forming the trench:
forming a source/drain region in the semiconductor substrate at opposite sides of the spacer by implanting dopant ions using the poly-gate as a mask.
4. The method of claim 3 , wherein the type of dopant ions used during forming the source/drain region is determined according to the predetermined depth of the trench.
5. The method of claim 1 , further comprising, before forming the trench:
forming a source/drain region in the semiconductor substrate at opposite sides of the poly-gate by implanting dopant ions using the poly-gate as a mask.
6. The method of claim 1 , wherein an energy level for implantation of dopant ions is determined according to the predetermined depth of the trench.
7. The method of claim 1 , wherein an energy level for implantation of dopant ions and the type of dopant ions are determined according to the predetermined depth of the trench.
8. The method of claim 1 , wherein the predetermined depth of the trench is determined according to an implantation depth of dopant ions.
9. The method of claim 1 , wherein the predetermined depth of the trench is determined according to a resistance of the poly-gate.
10. The method of claim 1 , wherein implanting dopant ions comprises implanting ions of one of phosphorus, boron and antimony ions.
11. A method for manufacturing a semiconductor device comprising:
forming a poly-gate having a first poly-gate portion and a second poly-gate portion over a semiconductor substrate; and then
forming a lightly doped drain region by implanting ions into the surface of the semiconductor substrate using the poly-gate as a mask; and then
forming a spacer at opposite sidewalls of the poly-gate; and then
forming a source/drain region in the semiconductor substrate at opposite sides of the spacer by implanting dopant ions using the poly-gate as a mask,
forming a trench at a predetermined depth in the second poly-gate portion; and then
implanting dopant ions into the entire surface of the semiconductor substrate and the poly-gate including the trench; and then
forming a silicide layer over the entire surface of the poly-gate including the trench; and then
forming a contact barrier layer over the second poly-gate portion including the trench while exposing an upper surface of the first poly-gate portion; and then
forming a contact over the exposed upper surface of the first poly-gate portion,
wherein the type of dopant ions used during forming the source/drain region is determined according to the predetermined depth of the trench.
12. A method for manufacturing a semiconductor device comprising:
forming a poly-gate having a first poly-gate portion and a second poly-gate portion over a semiconductor substrate; and then
forming a trench at a predetermined depth in the second poly-gate portion; and then
implanting dopant ions into the entire surface of the semiconductor substrate and the poly-gate including the trench; and then
forming a contact barrier layer over the second poly-gate portion including the trench while exposing an upper surface of the first poly-gate portion; and then
forming a contact over the exposed upper surface of the first poly-gate portion,
wherein the predetermined depth of the trench is determined according to an implantation depth of dopant ions.