IP Library Granted Patent US 7,834,397
Granted Patent B2
US 7,834,397 · App. 11/509,853 · Granted Nov 16, 2010

Thin film transistor, method of fabricating the same, and a display device including the thin film transistor

Assignee: Samsung Mobile Display Co., Ltd.
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Quick Facts
Patent No.
US 7,834,397
App. No.
11/509,853
Granted
Nov 16, 2010
Kind
B2
Abstract

A thin film transistor (TFT), a method of fabricating the same, and a display device including the TFT, are provided. In the TFT, a channel region is connected to a gate electrode so that the influence of a substrate bias is reduced or eliminated. Thus, the threshold voltage of the TFT is reduced, a subthreshold slope can be improved, and a large drain current can be obtained at a low gate voltage.

Claims (58)

1. A thin film transistor (TFT) comprising:

a substrate;

a gate electrode on the substrate;

a gate insulating layer on the gate electrode, such that the gate electrode is between the gate insulating layer and the substrate in a first direction normal to the substrate;

a semiconductor layer on the gate insulating layer, such that the gate insulating layer is between the semiconductor layer and the substrate in the first direction, the semiconductor layer including a channel region, a source region, and a drain region;

an interconnection portion at least partially in a different layer above or below that of the semiconductor layer and directly contacting the channel region of the semiconductor layer; and

a gate-body contact portion electrically connecting the interconnection portion and the gate electrode,

wherein the semiconductor layer is between the interconnection portion and the gate electrode in the first direction.

2. The TFT according to claim 1 , further comprising a heavily doped semiconductor layer between the channel region and the interconnection portion in the first direction.

3. A thin film transistor (TFT) comprising:

a substrate;

a gate electrode on the substrate;

a gate insulating layer on the gate electrode, such that the gate electrode is between the gate insulating layer and the substrate in a first direction normal to the substrate;

a semiconductor layer on the gate insulating layer, such that the gate insulating layer is between the semiconductor layer and the substrate in the first direction, the semiconductor layer including a channel region, a source region, and a drain region;

an interconnection portion directly contacting the channel region of the semiconductor layer; and

a gate-body contact portion electrically connecting the interconnection portion and the gate electrode,

further comprising source and drain electrodes, respectively, on the source and drain regions of the semiconductor layer,

wherein the interconnection portion is in the same layer as the source and drain electrodes, and

wherein the semiconductor layer is between the interconnection portion and the gate electrode in the first direction.

4. The TFT according to claim 1 , further comprising:

source and drain electrodes, respectively, on the source and drain regions of the semiconductor layer; and

heavily doped semiconductor layers respectively between the source and drain regions and the source and drain electrodes.

5. The TFT according to claim 1 , further comprising an interlayer insulating layer between the gate electrode and the gate-body contact portion,

wherein the interlayer insulating layer includes contact holes through which the gate-body contact portion is in contact with the interconnection portion and the gate electrode.

6. The TFT according to claim 1 , further comprising lightly doped drain (LDD) regions or offset regions respectively between the channel region of the semiconductor layer and the source and drain regions.

7. The TFT according to claim 1 , wherein the gate-body contact portion comprises indium tin oxide (ITO) or indium zinc oxide (IZO).

8. A thin film transistor (TFT) comprising:

a substrate;

a gate electrode and a semiconductor layer disposed on the substrate, the semiconductor layer having a region overlapping the gate electrode;

an interconnection portion electrically contacting the overlapped region of the semiconductor layer, a contact region between the interconnection portion and the overlapped region of the semiconductor layer being smaller than the overlapped region of the semiconductor layer; and

a gate-body contact portion electrically connecting the interconnection portion and the gate electrode.

9. The TFT according to claim 8 , further comprising a heavily doped semiconductor layer interposed between the interconnection portion and the semiconductor layer.

10. The TFT according to claim 8 ,

wherein the semiconductor layer includes source and drain regions spaced apart from the overlapped region of the semiconductor layer,

wherein the TFT further comprises source and drain electrodes respectively disposed on the source and drain regions, and

wherein the interconnection portion is disposed on the same layer as the source and drain electrodes.

11. The TFT according to claim 10 , further comprising LDD regions or offset regions respectively interposed between the overlapped region of the semiconductor layer and the source and drain regions.

12. The TFT according to claim 8 ,

wherein the semiconductor layer includes source and drain regions spaced apart from the overlapped region of the semiconductor layer, and

wherein the TFT further comprises:

source and drain electrodes respectively disposed on the source and drain regions; and

heavily doped semiconductor layers respectively interposed between the source and drain regions and the source and drain electrodes.

13. The TFT according to claim 12 , further comprising LDD regions or offset regions respectively interposed between the overlapped region of the semiconductor layer and the source and drain regions.

14. The TFT according to claim 8 , further comprising an interlayer insulating layer interposed between the gate electrode and the gate-body contact portion,

wherein the interlayer insulating layer includes contact holes through which the gate-body contact portion is in contact with the interconnection portion and the gate electrode.

15. The TFT according to claim 8 , wherein the gate-body contact portion is formed of ITO or IZO.

16. A display device comprising:

a substrate; and

a plurality of pixels on the substrate,

wherein at least one of the pixels comprises a thin film transistor (TFT) comprising:

a gate electrode on the substrate;

a gate insulating layer on the gate electrode, such that the gate electrode is between the gate insulating layer and the substrate in a first direction normal to the substrate;

a semiconductor layer on the gate insulating layer, such that the gate insulating layer is between the semiconductor layer and the substrate in the first direction, the semiconductor layer including a channel region, a source region, and a drain region;

an interconnection portion at least partially in a different layer above or below that of the semiconductor layer and directly contacting the channel region of the semiconductor layer; and

a gate-body contact portion electrically connecting the interconnection portion and the gate electrode, and

wherein the semiconductor layer is between the interconnection portion and the gate electrode in the first direction.

17. The TFT according to claim 3 , further comprising a heavily doped semiconductor layer between the channel region and the interconnection portion in the first direction.

18. The display device according to claim 16 , further comprising a heavily doped semiconductor layer between the channel region and the interconnection portion in the first direction.

Assignments (3)
MERGER Recorded Aug 23, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028840/0224 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 021973/0313 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2006
From: PARK, BYOUNG-KEON; CHOI, BYOUNG-DEOG; SO, MYEONG-SEOB
To: SAMSUNG SDI CO., LTD
Reel/Frame 018508/0385 →
Priority Claims (1)
KR 10-2005-0078757 · Aug 26, 2005 · national
Continuity (1)
Related Publication 20070052022A1 · Mar 8, 2007