IP Library › Granted Patent US 784,341
Granted Patent S1
US 784,341 · App. 29/551,135 · Granted Apr 18, 2017

Connection module

Inventors: SeongWhan Kim (Seoul, KR); Taehyoung Ko (Seoul, KR)
Assignee: Telit Communications S.p.A.
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Quick Facts
Patent No.
US 784,341
App. No.
29/551,135
Granted
Apr 18, 2017
Kind
S1
Claims (1)

The ornamental design for a connection module, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2019
From: HSBC BANK PLC
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 048466/0354 →
SECURITY INTEREST Recorded Oct 13, 2016
From: TELIT COMMUNICATIONS S.P.A
To: HSBC BANK PLC
Reel/Frame 040007/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2016
From: KIM, SEONGWHAN; KO, TAEHYOUNG
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 037478/0371 →