IP Library Granted Patent US 7,847,737
Granted Patent B2
US 7,847,737 · App. 12/169,094 · Granted Dec 7, 2010

Antenna apparatus

Assignee: Sony Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,847,737
App. No.
12/169,094
Granted
Dec 7, 2010
Kind
B2
Abstract

An antenna apparatus includes a patch antenna unit in which a radiation conductor and a ground conductor plate are arranged so as to face each other with an insulating material disposed therebetween, a power-feed point is provided at a position slightly offset from the center of the radiation conductor, and a high-frequency electric field is supplied between the radiation conductor and the ground conductor plate; a surface-wave propagation suppression area in which a surface-wave propagation suppression mechanism for suppressing surface-wave propagation is mounted in an outer surrounding area in the offset direction of the power-feed point in which an electric-field intensity is generally maximum within the end portion of the radiation conductor plate; and an insulating area in which an electric-field intensity between the radiation conductor plate and the ground conductor plate is relatively low and the surface-wave propagation suppression mechanism is not arranged.

Claims (7)

1. An antenna apparatus comprising:

a patch antenna unit in which a radiation conductor and a ground conductor plate are arranged so as to face each other with an insulating material disposed therebetween, a power-feed point is provided at a position slightly offset from the center of the radiation conductor, and a high-frequency electric field is supplied between the radiation conductor and the ground conductor plate;

a first surface-wave propagation suppression area in which a surface-wave propagation suppression mechanism for suppressing surface-wave propagation is mounted in a first outer surrounding area of the ground conductor plate in the offset direction of the power-feed point;

a second surface-wave propagation suppression area in which a second wave propagation suppression mechanism for suppressing surface-wave propagation is mounted in a second outer surrounding area of the ground conductor plate in a direction opposite the offset direction of the power-feed point; and

an insulating area in which an electric-field intensity between the radiation conductor plate and the ground conductor plate is relatively low and the surface-wave propagation suppression mechanism is not arranged.

2. The antenna apparatus according to claim 1 , wherein, in each of the surface-wave propagation suppression areas, a plurality of thumbtack-type artificial magnetic conductor elements, in each of which a plate-shaped conductor is supported by a post-shaped conductor, are arranged.

3. The antenna apparatus according to claim 1 , wherein, in each of the surface-wave propagation suppression areas, an artificial magnetic conductor element, in which texture is applied to a plate-shaped conductor, is arranged.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2008
From: KURODA, SHINICHI
To: SONY CORPORATION
Reel/Frame 021214/0641 →
Priority Claims (1)
JP P2007-180354 · Jul 9, 2007 · national
Continuity (1)
Related Publication 20090015499A1 · Jan 15, 2009