IP Library Granted Patent US 7,885,613
Granted Patent B2
US 7,885,613 · App. 11/911,349 · Granted Feb 8, 2011

Multiband high-frequency circuit, multiband high-frequency circuit device and multiband communications apparatus comprising same

Assignee: Hitachi Metals, Ltd.
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Quick Facts
Patent No.
US 7,885,613
App. No.
11/911,349
Granted
Feb 8, 2011
Kind
B2
Abstract

A multiband high-frequency circuit comprising a first switch SPDT 1 for switching the connections of a multiband antenna to transmitting circuits 11 bg -T, 11 a -T and receiving circuits 11 bg -R, 11 a -R of first and second communications systems, and a transmitting/receiving circuit BLT-TR of a third communications system, a diplexer circuit Dip 1 for branching a high-frequency signal to 11 a -R and 11 bg -R or BLT-TR and a diplexer circuit Dip 2 for branching a high-frequency signal to 11 bg -T and 11 a -T, both of which are disposed downstream of SPDT 1 , each diplexer circuit Dip 1 , Dip 2 comprising a lower-frequency-side filter and a high-frequency-side filter, a bandpass filter BPF 1 being disposed downstream of the lower-frequency-side filter of the diplexer circuit Dip 1 , and a second switch SPDT 2 being disposed downstream of the bandpass filter BPF 1.

Claims (17)

1. A multiband high-frequency circuit used between an antenna capable of conducting transmission and reception in at least three communications systems, and transmitting and receiving circuits of at least three communications systems, comprising

a first high-frequency switch circuit for switching the connections of said antenna to first and second paths, a first diplexer circuit disposed in said first path, and a second diplexer circuit disposed in said second path;

each of said first and second diplexer circuits comprising a lower-frequency-side filter circuit and a higher-frequency-side filter circuit;

a path connected to the lower-frequency-side filter circuit of said first diplexer circuit being provided with a bandpass filter circuit, and a second high-frequency switch circuit disposed downstream of said bandpass filter circuit for switching the two-way connection of said bandpass filter circuit to a receiving circuit of the first communications system and a transmitting/receiving circuit of the third communications system;

a path connected to the higher-frequency-side filter circuit of said first diplexer circuit being connected to a receiving circuit of the second communications system;

a path connected to the lower-frequency-side filter circuit of said second diplexer circuit being connected to a transmitting circuit of the first communications system; and

a path connected to the higher-frequency-side filter circuit of said second diplexer circuit being connected to a transmitting circuit of the second communications system.

2. The multiband high-frequency circuit according to claim 1 , which comprises a balanced-unbalanced conversion circuit between said second high-frequency switch circuit and the receiving circuit of said first communications system.

3. The multiband high-frequency circuit according to claim 1 , which comprises a balanced-unbalanced conversion circuit between said second high-frequency switch circuit and transmitting/receiving circuit of said third communications system.

4. The multiband high-frequency circuit according to claim 1 , which comprises a first high-frequency power amplifier in the path connected to the lower-frequency-side filter circuit of said second diplexer circuit, and a second high-frequency power amplifier in the path connected to the higher-frequency-side filter circuit of said second diplexer circuit, said first high-frequency power amplifier being connected to the transmitting circuit of said first communications system, and said second high-frequency power amplifier being connected to the transmitting circuit of said second system.

5. The multiband high-frequency circuit according to claim 1 , wherein the path connected to the higher-frequency-side filter circuit of said first diplexer circuit being provided with a low-noise amplifier connected to the receiving circuit of said second communications system.

6. The multiband high-frequency circuit according to claim 1 , which comprises a detection circuit between said antenna and said second diplexer circuit.

7. A multiband high-frequency circuit device having the multiband high-frequency circuit recited in claim 1 , which comprises a laminate substrate in which pluralities of circuit elements including at least one of line electrodes, capacitor electrodes, ground electrodes and via-holes are formed, circuit elements mounted on said laminate substrate, an antenna terminal, transmitting and receiving terminals of the first communications system, transmitting and receiving terminals of the second communications system, and a transmitting/receiving terminal of the third communications system.

8. The multiband high-frequency circuit device according to claim 7 , wherein the diplexer circuit and the bandpass filter circuit are constituted by inductance elements and capacitance elements formed in said laminate substrate.

9. The multiband high-frequency circuit device according to claim 7 , wherein the balanced-unbalanced conversion circuit is constituted by inductance elements and capacitance elements formed in said laminate substrate.

10. The multiband high-frequency circuit device according to claim 7 , wherein a semiconductor element constituting at least one of the high-frequency switch, the high-frequency power amplifier and the low-noise amplifier is mounted on said laminate substrate.

11. A multiband communications apparatus comprising the multiband high-frequency circuit device recited in claim 7 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2021
From: HITACHI METALS, LTD.
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 057780/0617 →
CHANGE OF ADDRESS Recorded Oct 12, 2021
From: HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 057778/0737 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2007
From: KEMMOCHI, SHIGERU; HAGIWARA, KAZUHIRO; FUKAMACHI, KEISUKE; WATANABE, MITSUHIRO
To: HITACHI METALS, LTD.
Reel/Frame 020099/0685 →
Priority Claims (1)
JP 2005-118312 · Apr 15, 2005 · national
Continuity (1)
Related Publication 20090017772A1 · Jan 15, 2009