Integrated-circuit package for proximity communication
Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.
1. A multi-chip module (MCM), comprising:
a first semiconductor die and a second semiconductor die, wherein a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die, and wherein the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors;
an alignment plate including a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die;
an interposer plate coupled to the alignment plate, wherein the interposer plate includes a positive feature, and wherein the interposer plate includes connectors to couple signals from a top surface of the interposer plate to a bottom surface of the interposer plate;
a top plate coupled to the interposer plate, wherein the top plate couples signals from a top surface of the top plate to the top surface of the interposer plate; and
a compression lid coupled to the top plate and the alignment plate, wherein the compression lid is configured to provide a clamping force to hold the alignment plate and the top plate in contact;
wherein the positive feature is coupled to the first semiconductor die; and
wherein the positive feature facilitates mechanical positioning of the first semiconductor die.
2. The MCM of claim 1 , wherein the mechanical positioning defines relative positions of the proximity connectors proximate to the surface of the first semiconductor die and the proximity connectors proximate to the surface of the second semiconductor die, wherein the relative positions are within a first pre-determined distance in a plane which includes the proximity connectors proximate to the surface of the first semiconductor die, and wherein the relative positions are within a second pre-determined distance in a direction which is substantially perpendicular to the plane.
3. The MCM of claim 1 , further comprising a component coupled to the proximity connectors proximate to the surface of the first semiconductor die and coupled to the proximity connectors proximate to the surface of the second semiconductor die.
4. The MCM of claim 3 , wherein the component is coupled to the given semiconductor die using a set of coupling elements.
5. The MCM of claim 4 , wherein the set of coupling elements includes micro-spheres.
6. The MCM of claim 1 , wherein the surface of the first semiconductor die faces the surface of the second semiconductor die.
7. The MCM of claim 1 , wherein the proximity communication includes optical communication.
8. The MCM of claim 1 , wherein the proximity connectors proximate to the surface of the first semiconductor die are capacitively coupled to the proximity connectors proximate to the surface of the second semiconductor die.
9. The MCM of claim 1 , wherein the positive feature includes a protrusion, and wherein at least a portion of the protrusion has a pyramidal shape.
10. The MCM of claim 1 , wherein a given negative feature, which can include the first negative feature or the second negative feature, includes a depression, and wherein at least a portion of the depression has a pyramidal shape.
11. The MCM of claim 1 , further comprising a base plate coupled to the alignment plate, wherein the first semiconductor die is coupled to the base plate using a set of coupling elements which facilitate the mechanical positioning.
12. The MCM of claim 11 , wherein the set of coupling elements includes micro-spheres.
13. The MCM of claim 12 , wherein the micro-spheres are positioned into depressions in the base plate and depressions in the alignment plate.
14. The MCM of claim 11 , wherein the set of coupling elements further facilitates an orientation of the first semiconductor die.
15. The MCM of claim 11 , wherein the base plate is configured to cool from the first semiconductor die.
16. The MCM of claim 1 , wherein the first semiconductor die is coupled to the second semiconductor die using a set of coupling elements which facilitate the mechanical positioning.
17. The MCM of claim 16 , wherein the set of coupling elements includes micro-spheres.
18. The MCM of claim 1 , wherein the top plate includes first connectors having a first size on a first surface of the top plate and second connectors having a second size on a second surface of the top plate;
wherein the top plate is configured to couple the first connectors to the given semiconductor die and to couple the first connectors to second connectors; and
wherein the second size is larger than the first size.
19. The MCM of claim 1 , wherein the compression lid includes one or more holes, wherein at least one optical fiber or ribbon cable are routed through each of the holes and coupled to the MCM.