Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package
Methods, systems, and apparatuses for ball grid array land patterns are provided. A ball grid array land pattern includes a plurality of land pads and electrically conductive traces. The plurality of land pads is arranged in an array of rows and columns. A perimeter edge of the array includes a pair of adjacent oblong shaped land pads. An electrically conductive trace is routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array. The oblong shaped land pads are narrower than standard round land pads, and thus provide more clearance for the routing of traces. The oblong shaped land pads enable more land pads of the land pattern array to be routed external to the array on each routing layer, and thus can save printed circuit board component and assembly costs.
1. A printed circuit board (PCB) configured to mount a ball grid array package, the PCB comprising:
a dielectric layer; and
an electrically conductive layer on the dielectric layer;
wherein the electrically conductive layer includes a plurality of land pads arranged in an array of rows and columns, wherein a perimeter edge of the array includes a pair of adjacent oblong shaped land pads;
wherein the electrically conductive layer further includes an electrically conductive trace routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array;
wherein the pair of adjacent oblong shaped land pads includes a first oblong shaped land pad and a second oblong shaped land pad, wherein the first oblong shaped land pad has a length along a first axis that is perpendicular to the perimeter edge and a width along a second axis that is perpendicular to the first axis, wherein the length is greater than the width;
wherein the interior of the array includes a plurality of substantially round land pads;
wherein a pair of adjacent substantially round land pads in the interior of the array are separated by a distance, D;
wherein
D<TW+ 2 ×TS,
where
TW=a width of the electrically conductive trace, and
TS=a manufacturing tolerance for spacing of the trace from other electrically conductive features of the electrically conductive layer.
2. The PCB of claim 1 , wherein the first oblong shaped land pad has opposing first and second ends along the first axis, wherein the first and second ends are rounded.
3. The PCB of claim 1 , wherein the first oblong shaped land pad is rectangular shaped.
4. The PCB of claim 1 , wherein each of the substantially round land pads has a diameter, DRP;
wherein
DRP>PP −( TW+ 2 ×TS ),
where
PP=a land pad-to-land pad pitch.
5. The PCB of claim 4 , wherein the width, W, of the first oblong shaped land pad is configured such that W<PP−(TW+2×TS).
6. The PCB of claim 1 , wherein each of a plurality of perimeter edges of the array includes a plurality of oblong shaped land pads.
7. The PCB of claim 6 , wherein the plurality of oblong shaped land pads enables the PCB to have fewer routing layers relative to a second PCB that includes a plurality of land pads arranged in a second array of rows and column, the second array not including oblong shaped land pads in perimeter edges of the second array.
8. The PCB of claim 1 , wherein the plurality of land pads is configured to mount a ball grid array package having an array of solder balls.
9. The PCB of claim 1 , wherein the electrically conductive trace is configured to route a signal from the land pad positioned in the interior of the array to the location external to the array.
10. The PCB of claim 1 , wherein the first oblong shaped land pad has an oval shape, an elliptical shape, an elongated hexagon shape, or an elongated octagon shape.
11. The PCB of claim 1 , wherein the array includes a round land pad in a corner of the array.
12. A ball grid array land pattern comprising:
a plurality of land pads arranged in an array of rows and columns, wherein a perimeter edge of the array includes a pair of adjacent oblong shaped land pads; and
an electrically conductive trace routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array;
wherein the pair of adjacent oblong shaped land pads includes a first oblong shaped land pad and a second oblong shaped land pad, wherein the first oblong shaped land pad has a length along a first axis that is perpendicular to the perimeter edge and a width along a second axis that is perpendicular to the first axis, wherein the length is greater than the width;
wherein the interior of the array includes a plurality of substantially round land pads;
wherein a pair of adjacent substantially round land pads in the interior of the array are separated by a distance D;
wherein
D<TW+ 2 ×TS,
where
TW=a width of the electrically conductive trace, and
TS=a manufacturing tolerance for spacing of the trace from other electrically conductive features of the land pattern.
13. The land pattern of claim 12 , wherein the first oblong shaped land pad has opposing first and second ends along the first axis, wherein the first and second ends are rounded.
14. The land pattern of claim 12 , wherein the first oblong shaped land pad is rectangular shaped.
15. The land pattern of claim 12 , wherein each of the substantially round land pads has a diameter, DRP;
wherein
DRP>PP −( TW+ 2 ×TS ),
where
W=the width of the first oblong shaped land pad, and
PP=a land pad-to-land pad pitch.
16. The land pattern of claim 15 , wherein the width, W, of the first oblong shaped land pad is configured such that W<PP−(TW+2×TS).
17. The land pattern of claim 12 , wherein each of a plurality of perimeter edges of the array includes a plurality of oblong shaped land pads.
18. The land pattern of claim 12 , wherein the plurality of land pads is configured to mount a ball grid array package having an array of solder balls.
19. The land pattern of claim 12 , wherein the electrically conductive trace is configured to route a signal from the land pad positioned in the interior of the array to the location external to the array.
20. The land pattern of claim 12 , wherein the first oblong shaped land pad has an oval shape, an elliptical shape, an elongated hexagon shape, or an elongated octagon shape.
21. The land pattern of claim 12 , wherein the array includes a round land pad in a corner of the array.