IP Library Granted Patent US 7,911,161
Granted Patent B2
US 7,911,161 · App. 11/769,772 · Granted Mar 22, 2011

Automotive power inverter with reduced capacitive coupling

Assignee: GM Global Technology Operations LLC
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Quick Facts
Patent No.
US 7,911,161
App. No.
11/769,772
Granted
Mar 22, 2011
Kind
B2
Abstract

An automotive power inverter is provided. The power inverter includes a chassis, a microelectronic die coupled to the chassis and having an integrated circuit formed thereon, and an insulating region between the chassis and the microelectronic die.

Claims (37)

1. An automotive power inverter comprising:

a chassis;

a microelectronic die coupled to the chassis having a plurality of power electronic switches formed thereon;

an insulating region having a thickness of at least 1 mm between the chassis and the microelectronic die; and

a cooling mechanism to remove heat from the microelectronic die, the cooling mechanism being electrically insulated from the chassis.

2. The automotive power inverter of claim 1 , wherein the microelectronic die generates a heat flux density of at least 10 W/cm2.

3. The automotive power inverter of claim 2 , wherein the cooling mechanism does not include a heat sink directly connected to the chassis.

4. The automotive power inverter of claim 3 , wherein the insulating region comprises at least one of an air gap and an insulating body.

5. The automotive power inverter of claim 4 , further comprising a housing connected to the chassis, the housing comprising an insulating material and forming a chamber, the microelectronic die being positioned within the chamber.

6. The automotive power inverter of claim 5 , wherein the cooling mechanism comprises a nozzle connected to the housing to direct a cooling fluid onto the microelectronic die to remove at least some of the heat from the microelectronic die.

7. The automotive power inverter of claim 6 , wherein said automotive power inverter does not include a heat sink.

8. An automotive power inverter comprising:

a chassis comprising a conductive material;

an insulating housing connected to the chassis and forming a chamber;

a microelectronic die connected to the housing within the chamber, the microelectronic die having an integrated circuit formed thereon;

a nozzle connected to the housing within the chamber and directed at the microelectronic die to spray a cooling fluid onto the microelectronic die to remove heat from the microelectronic die during operation thereof, wherein the nozzle is electrically insulated from the chassis; and

an insulating region between the chassis and the microelectronic die.

9. The automotive power inverter of claim 8 , wherein the insulating region comprises at least one of an air gap and an insulating body.

10. The automotive power inverter of claim 9 , wherein said automotive power inverter does not include a heat sink.

11. An automotive drive system comprising:

a direct current (DC) power supply;

an electric motor coupled to the DC power supply; and

a power inverter coupled to the electric motor and to the DC power supply to receive DC power from the DC power supply and provide alternating current (AC) power to the electric motor, the power inverter comprising:

a chassis comprising a conductive material;

a housing connected to the chassis, the housing comprising an insulating material and forming a chamber;

a microelectronic die connected to the housing within the chamber, the microelectronic die having an integrated circuit with at least one transistor formed thereon;

a nozzle connected to the housing within the chamber and directed at the microelectronic die to spray a cooling fluid onto the microelectronic die to remove heat from the microelectronic die during operation thereof, wherein the nozzle is electrically insulated from the chassis; and

an insulating region between the chassis and the microelectronic die.

12. The automotive drive system of claim 11 , further comprising a radiator coupled to the inverter to store the cooling fluid.

13. The automotive drive system of claim 12 , wherein the insulating region includes an air gap and wherein the microelectronic die is electrically insulated from the chassis.

14. The automotive drive system of claim 13 , wherein the power inverter does not include a heat sink.

15. The automotive power inverter of claim 6 , further comprising a fluid collection mechanism connected to the chassis to collect the cooling fluid and remove the cooling fluid from the chamber.

16. The automotive power inverter of claim 15 , wherein the fluid collection mechanism comprises an insulating material.

17. The automotive power inverter of claim 7 , wherein a distance between the chassis and the microelectronic die is at least 100 mm.

18. The automotive power inverter of claim 9 , wherein the insulating region comprises an air gap and an insulating body.

19. The automotive power inverter of claim 18 , wherein the insulating body comprises a sump connected to the chassis to collect the cooling fluid and remove the cooling fluid from the chamber.

20. The automotive drive system of claim 13 , further comprising a sump connected to the chassis to collect the cooling fluid and remove the cooling fluid from the chamber, the sump having a passageway therethrough, the passageway being in fluid communication with the radiator.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034185/0587 →
CHANGE OF NAME Recorded Feb 10, 2011
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 025781/0035 →
SECURITY AGREEMENT Recorded Nov 8, 2010
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: WILMINGTON TRUST COMPANY
Reel/Frame 025324/0057 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2010
From: UAW RETIREE MEDICAL BENEFITS TRUST
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025314/0946 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025245/0656 →
SECURITY AGREEMENT Recorded Aug 28, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UAW RETIREE MEDICAL BENEFITS TRUST
Reel/Frame 023162/0140 →
SECURITY AGREEMENT Recorded Aug 27, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 023156/0264 →
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2009
From: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023155/0663 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2009
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023124/0563 →
SECURITY AGREEMENT Recorded Apr 16, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
Reel/Frame 022553/0540 →
CORRECTIVE ASSIGNMENT TO CORRECT THE U.S. SERIAL NUMBER. PLEASE REMOVE THE U.S. SERIAL NO. 11/762772 AND REPLACE U.S. SERIAL NO. 11/769772 PREVIOUSLY RECORDED ON REEL 019558 FRAME 0091. ASSIGNOR(S) HEREBY CONFIRMS THE THE ORIGINAL ASSIGNMENT WAS FIELD WITH THE SERIAL NO. 11/762772.. Recorded Apr 14, 2009
From: WARD, TERENCE G.; SMITH, GREGORY SCOTT; JOHN, GEORGE; GOPALARATHNAM, TILAK; NELSON, DAVID F.
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC
Reel/Frame 022541/0787 →
SECURITY AGREEMENT Recorded Feb 3, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 022195/0334 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2008
From: WARD, TERENCE G.; SMITH, GREGORY SCOTT; JOHN, GEORGE; GOPALARATHNAM, TILAK; NELSON, DAVID F.
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC
Reel/Frame 021496/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2007
From: WARD, TERENCE G.; SMITH, GREGORY SCOTT; JOHN, GEORGE; GOPALARATHNAM, TILAK; NELSON, DAVID F.
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC
Reel/Frame 019558/0091 →
Continuity (1)
Related Publication 20090001909A1 · Jan 1, 2009