Optical semiconductor device
An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.
1. An optical semiconductor device, comprising:
a package having a bottom portion and a sidewall portion;
a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package;
a transparent member fixed to the semiconductor chip so as to cover the optical element; and
a sealing resin filling a space between the sidewall portion of the package and a side end face of the transparent member, wherein
the sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package,
the transparent member is exposed from a window portion formed by the overhang portion,
a top surface of the sealing resin is located between the sidewall portion of the package and the side end face of the transparent member, said top surface of the sealing resin having a first part and a second part,
the first part is exposed from the window portion, and
the second part is covered by the overhang portion.
2. The optical semiconductor device according to claim 1 , wherein the sealing resin covers a side end face of the transparent member.
3. The optical semiconductor device according to claim 1 , wherein a top surface of the transparent member is located higher than a top surface of the sidewall portion.
4. The optical semiconductor device according to claim 1 , wherein the overhang portion is formed integrally with the sidewall portion.
5. The optical semiconductor device according to claim 1 , wherein the overhang portion is a plate-like member bonded to the upper part of the sidewall portion.
6. The optical semiconductor device according to claim 1 , wherein the package is made of a molded resin.
7. The optical semiconductor device according to claim 1 , wherein the package is made of a ceramic lamination.
8. The optical semiconductor device according to claim 1 , wherein the optical element is a light receiving element or a light emitting element.