LED-based light module package including a ceramic layer and a light sensor
Disclosed is a light module package including a mounting substrate for mounting and electrically contacting at least one light emitting diode and a ceramic layer disposed in a path of light emitted by the light emitting diode. The ceramic layer includes a wavelength converting material and the light emitting diode is disposed between the ceramic layer and the mounting substrate. The light module package also includes a light sensor disposed at the mounting substrate for detecting a luminous output of the light emitting diode in order to control the brightness and/or the color of the light leaving the light module. The ceramic layer is only partly translucent to shield the light sensor against ambient light.
1. A light module package comprising:
at least one light emitting diode;
a mounting substrate for mounting and electrically contacting the at least one light emitting diode,
a ceramic layer comprising a wavelength converting material and disposed in a path of light emitted by the light emitting diode,
a light sensor disposed at the mounting substrate and having a sensitive area for detecting a luminous output of the light emitting diode wherein
the sensitive area directly faces the ceramic layer and
the ceramic layer is only partly translucent to shield the light sensor against ambient light.
2. A light module package as claimed in claim 1 , wherein the light sensor is integrated into the mounting substrate.
3. A light module package as claimed in claim 1 wherein the ceramic layer comprises a light guide directed to the light sensor.
4. A light module package as claimed in claim 3 , wherein the light guide extends to the light sensor.
5. A light module package as claimed in claim 1 , wherein the ceramic layer comprises a reflecting layer for providing an additional shielding against ambient light.
6. A light module package as claimed in claim 5 , wherein the ceramic layer has a top face and a bottom face ( 43 ), wherein the bottom face ( 43 ) is directed to the mounting substrate, wherein the reflecting layer is disposed on the top face.
7. A light module package as claimed in claim 1 , further comprising a temperature sensor disposed at the mounting substrate for measuring the temperature of the light emitting diode and/or of the light sensor.
8. A light module package as claimed in claim 1 , wherein the ceramic layer comprises a rigid agglomerate of phosphor particles.
9. A light module package as claimed in claim 1 , wherein the light sensor is disposed adjacent to the ceramic layer.