Repair soldering method for repairing a component which comprises a base material with an oriented microstructure
View Patent ↗The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
1. A repair method for repairing a component having a base material with an oriented microstructure, comprising:
applying a solder in a region of the component to be repaired wherein the solder comprises a constituent whose melting temperature is lower than the melting temperature of the component base material; and
heating the solder by directly irradiating the solder with a laser beam;
melting the solder material by the laser beam wherein the component base material is not melted;
choosing a speed of the laser beam relative to the component or a power of the laser beam for generating a temperature gradient in the region of the component to be repaired during the heating step to produce an oriented microstructure in the repaired site which comprises the same oriented microstructure as the surrounding base material,
wherein the solder comprises a first constituent with a melting temperature lower than a melting temperature of the component base material and a second constituent having a high durability and a melting temperature greater than the first constituent melting temperature but below the base material melting temperature so that both the first constituent and the second constituent in the solder are melted by the laser beam but the component base material is not melted, wherein a first solder composition in which the first constituent makes up a high proportion is applied first to establish bonding with the component base material, and a second solder composition in which the first constituent is reduced relative to the second constituent is subsequently applied to increase the strength of the component.
2. The repair method as claimed in claim 1 , wherein the temperature gradient is aligned so that it extends in the direction of the orientation of the oriented microstructure of the component base material.
3. The repair method as claimed in claim 1 , wherein the base material is heat treated during the soldering step.
4. The repair method as claimed in claim 3 , wherein the solder is in the form of a powder, paste or film.
5. The repair method as claimed in claim 4 , wherein the solder powder is a nanopowder.