IP Library Granted Patent US 7,974,023
Granted Patent B1
US 7,974,023 · App. 12/721,567 · Granted Jul 5, 2011

Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof

Assignee: Himax Semiconductor, Inc.
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Quick Facts
Patent No.
US 7,974,023
App. No.
12/721,567
Granted
Jul 5, 2011
Kind
B1
Abstract

A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.

Claims (12)

1. A wafer level optical lens module, comprising:

a first wafer level optical lens substrate, comprising:

a first substrate, having at least one first through hole and at least one first flange, wherein each first flange is located on an side wall in each first through hole, and the first substrate has a first surface and the first surface has an alignment protrusion disposed thereon;

at least one first lens, each located within each first through hole and embedded with each first flange, and a thickness of each first lens being less than a thickness of the first substrate;

a second wafer level optical lens substrate, connected to the first wafer level optical lens substrate, the second wafer level optical lens substrate comprising:

a second substrate, having at least one second through hole and at least one second flange, wherein each second flange is located on a side wall in each second through hole, and the second substrate has a second surface and the second surface has at least one alignment hole disposed thereon and arranged oppositely to each alignment protrusion; and

at least one second lens, each located within each second through hole and embedded with each second flange, and a thickness of each second lens being less than a thickness of the second substrate,

wherein the first alignment protrusion of the first wafer level optical lens substrate is embedded with the second alignment hole of the second wafer level optical lens substrate to connect the first wafer level optical lens substrate and the second wafer level optical lens substrate.

2. The wafer level optical lens module as claimed in claim 1 , wherein a shape of the first flange or the second flange located on each side wall is a cuboid or a trigonal prism.

3. The wafer level optical lens module as claimed in claim 1 , wherein a material of the substrate is a light-shielding material or a light-absorbing material.

4. The wafer level optical lens module as claimed in claim 3 , wherein the light-shielding material is a black colloid.

5. The wafer level optical lens module as claimed in claim 1 , wherein the first lens and the second lens each comprises a convex lens or a concave lens.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2018
From: HIMAX SEMICONDUCTOR, INC.
To: HIMAX TECHNOLOGIES LIMITED
Reel/Frame 046222/0554 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2010
From: CHEN, CHENG-HENG
To: HIMAX SEMICONDUCTOR, INC.
Reel/Frame 024097/0628 →