Contact spring application to semiconductor devices
A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
1. A semiconductor package spring contact applicator comprising:
a substrate;
a removable encapsulating layer formed on the substrate;
a plurality of spring contacts arrayed in the removable encapsulating layer, wherein each spring contact is positioned to have an anchor end with a bond pad adjacent to an upper surface of the removable encapsulating layer and a free end near the substrate, the removable encapsulating layer being removable separate from the spring contact;
a handle release layer on the removable encapsulating layer; and
a handle substrate on the handle release layer, wherein the handle substrate is arranged to be removed with the handle release layer.
2. The spring contact applicator of claim 1 , wherein the substrate comprises a flexible sheet and/or tape.
3. The spring contact applicator of claim 1 , wherein the substrate comprises a rigid material.
4. The spring contact applicator of claim 1 , wherein the removable encapsulating layer comprises a wax.
5. The spring contact applicator of claim 1 , wherein each spring contact has cladding.