IP Library Granted Patent US 7,991,179
Granted Patent B2
US 7,991,179 · App. 11/471,159 · Granted Aug 2, 2011

High fidelity noise-excluding earphones with ergonomically designed construction

Assignee: Etymotic Research, Inc.
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Quick Facts
Patent No.
US 7,991,179
App. No.
11/471,159
Granted
Aug 2, 2011
Kind
B2
Abstract

An insert high fidelity earphone is provided in which a hollow housing is connected to two tubes. A first tube is connected to the hollow housing on one side, and on the other side is inserted into an ear tip that ensures substantial sealing of the ear canal. A second tube is connected to hollow housing on one side and houses a cable that connects circuitry in the hollow housing to an audio source. The first tube comprises a damping assembly. The first tube comprises grooves on the inside wall that ensure that the damping assembly only fits in one orientation, which is the correct orientation. The damping assembly may be easily replaceable, without having to replace the entire earphone. The earphone may have a curved shape providing a comfortable and nearly invisible fit into the ear canal.

Claims (15)

1. An insert earphone assembly comprising:

a hollow curved housing cap, wherein said hollow curved housing cap houses earphone circuitry;

a sound tube connected to said hollow curved housing cap, wherein said sound tube is inserted into an ear tip, wherein said sound tube houses a removable damper assembly comprising a damper plug affixed with a damper filter and comprising a protruding ring, and wherein an inside of said sound tube comprises grooves for mating with said protruding ring of said damper plug to ensure correct insertion of said removable damper assembly; and

a grommet connected to said hollow curved housing cap, wherein said grommet houses a cable that connects said earphone circuitry to an audio source.

2. The insert earphone assembly of claim 1 further comprising a plug connected to said cable, wherein said plug is inserted into said audio source.

3. The insert earphone assembly of claim 1 further comprising a clip mounted on said cable, wherein said clip fastens said cable to an object.

4. The insert earphone assembly of claim 1 wherein said ear tip substantially sealing an ear canal, when inserted into said ear canal.

5. The insert earphone assembly of claim 1 further comprising a circuitry mounted on said cable, wherein said circuitry comprises controls for adjusting at least one of: volume and bass of an audio signal from said audio source.

6. A high fidelity earphone comprising:

a hollow curved housing cap, wherein said hollow curved housing cap houses earphone circuitry;

a sound tube connected to said hollow curved housing cap, wherein said sound tube is inserted into an ear tip, wherein said sound tube houses a removable damper assembly comprising a damper plug affixed with a damper filter and comprising a protruding ring, and wherein an inside of said sound tube comprises grooves for mating with said protruding ring of said damper plug to ensure correct insertion of said removable damper assembly; and

a grommet connected to said hollow curved housing cap, wherein said grommet houses a cable that connects said earphone circuitry to an audio source.

7. The high fidelity earphone of claim 6 wherein said ear tip substantially sealing an ear canal, when inserted into said ear canal.

8. The high fidelity earphone of claim 6 wherein said ear tip comprises a three-flange ear tip.

9. The high fidelity earphone of claim 6 wherein said ear tip comprises a foam ear tip.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 14, 2022
From: JPMORGAN CHASE BANK, N.A.
To: ETYMOTIC RESEARCH, INC.
Reel/Frame 060380/0475 →
SECURITY INTEREST Recorded Apr 12, 2018
From: ETYMOTIC RESEARCH, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 045922/0320 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2011
From: DRAMBAREAN, VIOREL; HAAPAPURO, ANDREW J.; KILLION, MEAD C.
To: ETYMOTIC RESEARCH, INC.
Reel/Frame 026049/0960 →
Continuity (2)
Provisional Application 60692508 · Jun 20, 2005
Related Publication 20060285715A1 · Dec 21, 2006