Component attach methods and related device structures
A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, providing the component having a backside surface, disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer, and moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer. The attachment material can include a solder. A light-emitting device is also described that comprises a component including a light-emitting die, wherein the component is supported by a substrate, and wherein the light-emitting die comprises a light emission surface and a backside surface disposed opposite the light emission surface. The light emission surface of the light-emitting die has an area greater than or equal to 1 mm 2 and an attachment material layer is disposed between the backside surface of the light-emitting die and the substrate, wherein the attachment material layer has voiding of less than 5% of an area of the backside surface.
1. A method of attaching a component, the method comprising:
disposing an attachment material layer over a surface;
providing the component having a backside surface;
disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer; and
moving the component relative the surface such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer.
2. The method of claim 1 , wherein the attachment material comprises a solder.
3. The method of claim 2 , wherein the surface comprises a solderable portion and a non-solderable portion, and wherein the solder is constrained to the solderable portion of the surface.
4. The method of claim 3 , wherein the substantial portion of the backside surface of the component that is not disposed over the attachment material layer is disposed over the non-solderable portion of the surface.
5. The method of claim 2 , further comprising disposing flux material between the solder and the backside surface of the component.
6. The method of claim 5 , wherein moving the component comprises heating the solder.
7. The method of claim 6 , wherein heating the solder comprises increasing the temperature of the solder from less than or equal to an activation temperature of the flux material to at least a reflow temperature of the solder within less than one minute.
8. The method of claim 2 , wherein disposing an attachment material layer over the surface comprises disposing a preformed solder over the surface.
9. The method of claim 8 , wherein the preformed solder has a substantially similar area as the component.
10. The method of claim 2 , wherein disposing an attachment material layer over the surface comprises disposing a solder paste over the surface.
11. The method of claim 2 , wherein after moving the component such that the component is attached to the at least a portion of the solder layer, the solder layer has voiding of less than 5% of an area of the backside surface of the component.
12. The method of claim 2 , wherein after moving the component such that the component is attached to the at least a portion of the solder layer, the solder layer has voiding of less than 1% of an area of the backside surface of the component.
13. The method of claim 1 , wherein moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer comprises moving the component such that the component is attached to substantially all of the attachment material layer.
14. The method of claim 1 , wherein moving the component comprises moving the die at least partially due to a surface tension force of the attachment material layer.
15. The method of claim 1 , wherein moving the component comprises moving the die at least partially due to an external force.
16. The method of claim 1 , wherein the component comprises a light-emitting die.
17. The method of claim 16 , wherein the light-emitting die has a light emission surface area greater than 1 mm 2 .
18. The method of claim 16 , wherein the light-emitting die has a light emission surface area greater than 3 mm 2 .
19. The method of claim 16 , wherein the light-emitting die has a light emission surface area greater than 10 mm 2 .