Micro-component packaging process and set of micro-components resulting from this process
A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.
1. A structure, comprising:
a substrate;
a heat shield disposed over a portion of the substrate and formed at least by the area of at least one metal layer;
a cover plate disposed over the substrate and the heat shield;
a cavity having a first wall formed by the substrate and having a second wall formed by the cover plate; and
a micro electromechanical component disposed under the heat shield in the cavity that is protected from electromagnetic radiation by the heat shield, wherein a portion of the substrate not aligned with the micro electromechanical component is exposed to electromagnetic radiation.
2. The structure of claim 1 , further comprising a layer of metal disposed between the substrate and the cover plate.
3. The structure of claim 1 wherein the cavity has fourth, fifth, and sixth walls formed by the substrate.
4. An integrated circuit, comprising:
a substrate;
a cover plate disposed over the substrate;
a cavity having a first wall formed by the substrate and having a second wall formed by the cover plate;
a micro electromechanical component disposed in the cavity; and
a heat shield disposed over the micro electromechanical component and under the cover plate, and formed at least by the area of at least one metal layer to prevent electromagnetic radiation from irradiating the substrate aligned with the micro electromechanical component.
5. A system, comprising:
a structure including,
a substrate;
a cover plate disposed over the substrate;
a cavity having a first wall formed by the substrate and having a second wall formed by the cover plate;
a micro electromechanical component disposed in the cavity; and
a radiation shield disposed over the micro electromechanical component and under the cover plate, and having at least one hole disposed over a portion of the substrate not aligned with the electromechanical component.