Circuit board, electronic device including a circuit board, and method of manufacturing a circuit board
A circuit board includes a board, a first conductive pad provided on the board, a second conductive pad provided with a first distance from the first conductive pad. A mask extends over the board and has an opening that extends over at least a part of the first conductive pad, at least a part of the second conductive pad, and at least a part of an intervening region of the board between the first and second conductive pads. A conductive material is provided in the opening, and extends over the at least a part of the first conductive pad, the at least a part of the intervening region, and the at least a part of the second conductive pad.
1. A circuit board used for reflow soldering, comprising:
a board;
a first conductive pad provided on the board;
a second conductive pad provided with a first distance from the first conductive pad;
a mask covering a surface of the board, the mask having an opening, the opening extending over the first conductive pad, the second conductive pad and an intervening region of the board between the first and second conductive pads; and
a reflowed solder that fills the opening, the reflowed solder extending over the first conductive pad, the second conductive pad and the intervening region, the reflowed solder connecting the first conductive pad and the second conductive pad, wherein
the opening is substantially elliptical in shape,
the intervening region is positioned at a center region of the opening in a longitudinal direction of the opening,
the first and second conductive pads are positioned at opposite side regions of the opening in the longitudinal direction, and
the first and second conductive pads respectively have first and second edges that confront each other and that are straight and parallel to each other, wherein
the first conductive pad and the second conductive pad are semi-elliptical in shape.
2. The circuit board according to claim 1 , wherein the opening comprises first and second areas which are positioned over the first and second conductive pads, respectively, a third area which is positioned over the intervening region of the board, and the third area is wider than the first and second areas in a direction perpendicular to the longitudinal direction.
3. circuit board according to claim 2 , wherein
the first and second areas of the opening have first and second lengths in the direction perpendicular to the longitudinal direction, and
the third area of the opening has a third length in the longitudinal direction that is shorter than the first and second lengths.
4. The circuit board according to claim 1 , wherein the opening comprises first and second areas which are positioned over the first and second conductive pads, respectively, the first area is smaller than the first conductive pad, the second area is smaller than the second conductive pad.
5. The circuit board according to claim 1 , further comprising:
a first mounting pad provided on the board; and
a second mounting pad provided with a second distance from the first conductive pad,
wherein the first distance is shorter than the second distance.
6. The circuit board according to claim 1 , wherein the surface of the board is lower in applicability of the reflowed solder than the surfaces of the first and second conductive pads.