IP Library Granted Patent US 8,017,965
Granted Patent B2
US 8,017,965 · App. 12/881,059 · Granted Sep 13, 2011

Semiconductor light emitting device

Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,017,965
App. No.
12/881,059
Granted
Sep 13, 2011
Kind
B2
Abstract

A semiconductor light emitting device is provided. The semiconductor light emitting device includes a first conductive semiconductor layer; an active layer on the first conductive semiconductor layer; a first quantum dot layer on the active layer; and a second conductive semiconductor layer on the first quantum dot layer.

Claims (44)

1. A semiconductor light emitting device comprising:

a substrate;

a first conductive type semiconductor layer on the substrate;

an active layer on the first conductive type semiconductor layer;

a first cladding layer on the active layer;

a nitride-based semiconductor layer on the first cladding layer; and

a second conductive type semiconductor layer on the nitride-based semiconductor layer,

wherein the first cladding layer and the nitride-based semiconductor layer comprise different semiconductor materials such that the nitride-based semiconductor layer has a lattice mismatch with respect to the first cladding layer, and

wherein the nitride-based semiconductor layer comprises an In-rich nitride-based semiconductor layer.

2. The semiconductor light emitting device according to claim 1 , wherein the first cladding layer comprises an AlGaN layer or an AlInGaN layer.

3. The semiconductor light emitting device according to claim 1 , wherein the nitride-based semiconductor layer is doped with an amount of In that is 10 to 500 times an amount of Ga.

4. The semiconductor light emitting device according to claim 1 , wherein the first cladding layer includes a p-AlGaN layer and the nitride-based semiconductor layer includes an InGaN layer.

5. A semiconductor light emitting device comprising:

a substrate;

a first conductive type semiconductor layer on the substrate;

an active layer on the first conductive type semiconductor layer;

a first cladding layer on the active layer;

a nitride-based semiconductor layer on the first cladding layer;

a first capping layer on the nitride-based semiconductor layer, wherein the first capping layer comprises an N-rich GaN layer or a Ga-rich GaN layer; and

a second conductive type semiconductor layer on the first capping layer,

wherein the first cladding layer and the nitride-based semiconductor layer comprise different semiconductor material such that the nitride-based semiconductor layer has a lattice mismatch with respect to the first cladding layer.

6. The semiconductor light emitting device according to claim 5 , wherein a pair of the nitride-based semiconductor layer and the first capping layer is from one to ten pairs.

7. The semiconductor light emitting device according to claim 5 , wherein at least one of the nitride-based semiconductor layer, the first cladding layer and the first capping layer comprises a second conductive type dopant.

8. A semiconductor light emitting device comprising:

a substrate;

a first conductive type semiconductor layer on the substrate;

an active layer on the first conductive type semiconductor layer;

a first cladding layer on the active layer;

a nitride-based semiconductor layer on the first cladding layer; and

a second conductive type semiconductor layer on the nitride-based semiconductor layer,

wherein the first cladding layer and the nitride-based semiconductor layer comprise different semiconductor materials such that the nitride-based semiconductor layer has a lattice mismatch with respect to the first cladding layer, and

wherein the nitride-based semiconductor layer comprises a roughness shape on a top surface thereof.

9. The semiconductor light emitting device according to claim 8 , wherein the roughness shape comprises a three-dimensional structure including a plurality of quantum dots, a diameter of the quantum dots is 50 nm to 200 nm, and a height of the quantum dots is 1 nm to 20 nm.

10. The semiconductor light emitting device according to claim 8 , wherein the concentration of the roughness is between 1×10 8 /cm 2 ˜5×10 10 /cm 2 .

11. The semiconductor light emitting device according to claim 8 , wherein the nitride-based semiconductor layer and/or the first capping layer is doped with a first conductive dopant or a second conductive dopant.

12. The semiconductor light emitting device according to claim 8 , wherein the first conductive type semiconductor layer is an n-type semiconductor layer and the second conductive type semiconductor layer is a p-type semiconductor layer and the p-type semiconductor layer is formed of at least one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN layers.

13. The semiconductor light emitting device according to claim 8 , wherein the first conductive type semiconductor layer is a p-type semiconductor layer and the second conductive type semiconductor layer is an n-type semiconductor layer.

14. The semiconductor light emitting device according to claim 8 , wherein the active layer has a single quantum well or multi quantum well (MQW) structure and is formed of Al X Ga Y In 1-X-Y N/Al X Ga Y In 1-X-Y N (0≦X, 0≦Y, X+Y≦1).

15. The semiconductor light emitting device according to claim 8 , further comprising a buffer layer between the substrate and the first conductive type semiconductor layer.

16. The semiconductor light emitting device according to claim 8 , further comprising an undoped semiconductor layer between the substrate and the first conductive type semiconductor layer.

17. The semiconductor light emitting device according to claim 8 , wherein the nitride-based semiconductor layer comprise In-rich nitride-based semiconductor layer.

18. The semiconductor light emitting device according to claim 8 , wherein the first cladding layer comprises an AlGaN layer or an AlInGaN layer.

19. The semiconductor light emitting device according to claim 8 , further comprising a first capping layer between the nitride-based semiconductor layer and the second conductive type semiconductor layer, wherein the first capping layer comprises an N-rich GaN layer or a Ga-rich GaN layer.

20. The semiconductor light emitting device according to claim 19 , wherein a pair of the nitride-based semiconductor layer and the first capping layer is from one to ten pairs.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (2)
KR 10-2007-0060934 · Jun 21, 2007 · national
KR 10-2007-0060935 · Jun 21, 2007 · national
Continuity (2)
Continuation 12144184 · Jun 23, 2008
Related Publication 20110006283A1 · Jan 13, 2011