System and method for providing even heat distribution and cooling return pads
A return pad for use with an electrosurgical system is disclosed. The return pad includes a conductive layer, a contact layer configured to engage a patient's skin and an intermediate layer disposed between the conductive layer and the contact layer. The intermediate layer is adapted to distribute energy.
1. A return pad for use with an electrosurgical system, comprising:
a conductive layer;
a contact layer disposed on the conductive layer and configured to engage patient skin;
a cooling section disposed on the conductive layer and configured to reduce the temperature of at least one of the contact layer and the conductive layer; and
a backing layer disposed on the cooling section and adapted to allow heat to dissipate therethrough,
wherein the conductive layer, contact layer and cooling section are substantially coterminous.
2. The return pad according to claim 1 , wherein the cooling section is configured to absorb thermal energy generated in the return pad.
3. The return pad according to claim 1 , wherein the cooling section is configured to absorb thermal energy from the conductive layer and the contact layer.
4. The return pad according to claim 1 , wherein the cooling section includes a passive cooling device.
5. The return pad according to claim 1 , wherein the cooling section includes a Peltier cooling device.
6. The return pad according to claim 1 , wherein the cooling section includes a chemical layer.
7. The return pad according to claim 6 , wherein the backing layer is permeable to air and impermeable to the chemical layer.
8. The return pad according to claim 1 , wherein the backing layer is includes a breathable material that is configured to allow thermal energy from the cooling layer to dissipate therethrough and into the surrounding area.
9. The return pad according to claim 1 , wherein the backing layer includes an impervious material that forms one of an air-tight seal and a liquid-tight seal with the conductive layer.
10. The return pad according to claim 9 , wherein the backing layer facilitates circulation of a fluid.
11. The return pad according to claim 9 , wherein the backing layer and the conductive layer form a cooling chamber configured to circulate cooling fluid therewithin.
12. The return pad according to claim 11 , wherein the cooling chamber is further defined by a plurality of dimples formed on the backing layer.
13. The return pad according to claim 11 , wherein the cooling chamber is further defined by one or more channels formed in the backing layer.
14. The return pad according to claim 11 , wherein the cooling chamber is further defined by one or more channels formed in the conductive layer.
15. The return pad according to claim 1 , wherein the cooling section further includes a heat exchanger and the backing layer is formed of highly permeable material that is configured to allow thermal energy to dissipate to the surrounding area.
16. The return pad according to claim 1 , wherein the backing layer is treated with a thermo-mechanically expanded polytetrafluoroethylene.
17. The return pad according to claim 1 , wherein the backing layer is a porous hydrophobic material.