IP Library Granted Patent US 8,022,308
Granted Patent B2
US 8,022,308 · App. 11/902,553 · Granted Sep 20, 2011

Wired circuit board and electronic device

Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 8,022,308
App. No.
11/902,553
Granted
Sep 20, 2011
Kind
B2
Abstract

A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.

Claims (31)

1. A wired circuit board comprising:

a base insulating layer extending in a longitudinal direction and forming a first insulating layer;

a second insulating layer formed on top of the first insulating layer;

a conductive layer having a plurality of signal wirings formed on the second insulating layer and in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the base insulating layer and the second insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings;

a ground layer formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction, with a lower surface of the ground layer being formed on a top surface of the base insulating layer; and

a cover insulating layer extending in the longitudinal direction and which covers the conductive layer and the ground layer, the cover insulating layer being shorter in the longitudinal direction than the base insulating layer and the second insulating layer, such that the connecting terminals provided on both longitudinal ends of each of the signal wirings are exposed from the cover insulating layer,

wherein a slit along the longitudinal direction is formed between each of the signal wirings and penetrates completely through the base insulating layer, the second insulating layer, and the cover insulating layer in the thickness direction, and

wherein the slit is formed to extend adjacent to each of the connecting terminals on one side in the longitudinal direction, and adjacent to each of the connecting terminals on the other side in the longitudinal direction.

2. The wired circuit board according to claim 1 , wherein the slit has round holes disposed at both longitudinal ends thereof to outwardly protrude in a widthwise direction.

3. The wired circuit board according to claim 1 , wherein both longitudinal ends of the slit respectively extend proximate to an edge of the cover insulating layer on the one side in the longitudinal direction and on the other side in the longitudinal direction, such that the slit is not formed where the connecting terminals provided on both longitudinal ends of each of the signal wirings are exposed from the cover insulating layer.

4. The wired circuit board according to claim 1 , wherein the cover insulating layer comprises a third insulating layer and a fourth insulating layer.

5. An electronic device comprising:

a first casing;

a second casing connected to the first casing;

a connecting member for connecting the first casing and the second casing so as to be relatively rotatable; and

a wired circuit board comprising:

a base insulating layer extending in a longitudinal direction and forming a first insulating layer,

a second insulating layer formed on top of the first insulating layer,

a conductive layer having a plurality of signal wirings formed on the second insulating layer and in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the base insulating layer and the second insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings,

a ground layer formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction, with a lower surface of the ground layer being formed on a top surface of the base insulating layer, and

a cover insulating layer extending in the longitudinal direction and which covers the conductive layer and the ground layer, the cover insulating layer being shorter in the longitudinal direction than the base insulating layer and the second insulating layer, such that the connecting terminals provided on both longitudinal ends of each of the signal wirings are exposed from the cover insulating layer, the base insulating layer and the cover insulating layer being formed with a slit between each of the signal wirings along the longitudinal direction, the slit penetrating completely through the base insulating layer, the second insulating layer, and the cover insulating layer in the thickness direction, and the slit being formed to extend adjacent to each of the connecting terminals on one side in the longitudinal direction, and adjacent to each of the connecting terminals on the other side in the longitudinal direction, wherein:

each of the connecting terminals on one side in a longitudinal direction is connected to an electronic component of the first casing;

each of the connecting terminals on the other side in the longitudinal direction is connected to an electronic component of the second casing; and

each of the signal wirings is disposed around the connecting member and is arranged parallel along a direction in which the first casing and the second casing relatively rotate.

6. A wired circuit board comprising:

an insulating layer extending in a longitudinal direction;

a conductive layer having a plurality of signal wirings covered with the insulating layer and in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer; and

a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction,

wherein a slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer,

wherein the slit is formed to extend adjacent to each of the connecting terminals on one side in the longitudinal direction, and adjacent to each of the connecting terminals on the other side in the longitudinal direction, and

wherein the slit has round holes disposed at both longitudinal ends thereof to outwardly protrude in a widthwise direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2007
From: HU, SZU-HAN; HO, VOON YEE; YAMAZAKI, HIROSHI; MCCASLIN, MARTIN JOHN
To: NITTO DENKO CORPORATION
Reel/Frame 020192/0689 →
Priority Claims (1)
JP 2006-271035 · Oct 2, 2006 · national
Continuity (1)
Related Publication 20080078573A1 · Apr 3, 2008