Electrical component having a reduced substrate area

1. An electrical component comprising:

a substrate having a surface;

component structures connected to the surface of the substrate; and

solder metal platings electrically connected to the component structures;

wherein the substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via connections formed by solder bumps, the solder bumps mating to the solder metal platings;

wherein at least one of the solder bumps is on a first solder metal plating;

wherein the first solder metal plating has first and second dimensions, the first dimension being larger than the second dimension, the first and second dimensions being along a same surface that is parallel to the surface of the substrate; and

wherein the first solder metal plating is elliptical in shape, circular in shape, or rectangular in shape containing only rounded ends.

2. The electrical component of claim 1 , wherein the component structures and the solder metal platings are on a same surface of the substrate.

3. The electrical component of claim 2 , wherein the first solder metal plating is between an edge of the substrate and the component structures; and

wherein the first dimension is substantially parallel to the edge.

4. The electrical component of claim 2 , wherein the first solder metal plating is between at least two of the component structures; and

wherein the first dimension is substantially parallel to an edge of a component structure.

5. The electrical component of claim 1 , wherein the component structures comprise a surface acoustic wave filter.

6. The electrical component of claim 5 , wherein the surface acoustic wave filter comprises an interdigital transducer and a reflector, the reflector comprising reflector fingers.

7. The electrical component of claim 6 , wherein the reflector is beveled and at least one of the solder metal platings is at least partially in an area that is not covered by a beveled reflector.

8. The electrical component of claim 7 , wherein the beveled reflector comprises a first group of reflector fingers and a second group of reflector fingers, the first group being closer to the interdigital transducer than the second group; and reflector fingers in the second group have different lengths.

9. The electrical component of claim 8 , wherein the first group comprises 20 to 50 reflector fingers.

10. The electrical component of claim 5 , wherein the surface acoustic wave filter comprises a DMS filter.

11. The electrical component of claim 1 , wherein at least one of the component structures comprises a surface acoustic wave filter having a DMS filter type and resonators connected thereto.

12. The electrical component of claim 1 , wherein at least one of the component structures comprises a ladder-type filter.

13. The electrical component of claim 1 , wherein the substrate comprises a piezoelectric substrate.

14. The electrical component of claim 13 , wherein the piezoelectric substrate comprises at least one of LiTaO 3 and LiNbO 3 .

15. The electrical component of claim 1 , wherein the substrate comprises silicon.

16. The electrical component of claim 1 , wherein at least one of the component structures comprises a bulk acoustic wave filter.

17. The electrical component of claim 1 , wherein the substrate is substantially rectangular and at least some of the component structures are oriented substantially parallel to a diagonal axis of the substrate.

18. The electrical component of claim 17 , wherein the first solder metal plating is substantially on the diagonal axis.

19. The electrical component of claim 1 , wherein at least one of the component structures comprises a high-frequency filter.