A mirror device, comprising: a mirror; an electrode which is placed on a substrate and on which surface a cavity is formed; and a hinge placed between the mirror and electrode, wherein the hinge is connected to the cavity of the electrode.
1. A mirror device, comprising:
a substrate having a wiring circuit disposed on a top surface of the substrate covered under an insulation layer;
an electrode disposed on top of the insulation layer and connected to the wiring circuit through a via connector penetrating through an opening in the insulation layer; and
a micro-electrical mechanical system (MEMS) structure directly connected to the electrode.
2. The mirror device according to claim 1 , wherein:
the electrode further includes a top portion to support the MEMS structure wherein the MEMS structure further comprises an elastic part of a hinge.
3. The mirror device according to claim 1 , wherein:
the electrode is further composed of an electrically conductive material includes at least one of a group of materials consisting of a metallic conductive material, a cooper, an aluminum, a tungsten, and an alloy of the metallic material.