IP Library Granted Patent US 8,027,217
Granted Patent B2
US 8,027,217 · App. 11/881,505 · Granted Sep 27, 2011

Supply voltage distribution system with reduced resistance for semiconductor devices

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Quick Facts
Patent No.
US 8,027,217
App. No.
11/881,505
Granted
Sep 27, 2011
Kind
B2
Abstract

A supply voltage distribution system for distributing a supply voltage through a semiconductor device, the supply voltage distribution system comprising: a first supply voltage distribution line arrangement and a second supply voltage distribution line arrangement, said first supply voltage distribution line arrangement and said second supply voltage distribution line arrangement being adapted to receive from outside the semiconductor device a semiconductor device supply voltage and to distribute a supply voltage to respective first and second portions of the semiconductor device; a voltage-to-voltage conversion circuit connected to the first supply voltage distribution line arrangement, wherein the voltage-to-voltage conversion circuit is adapted to either transfer onto the first supply voltage distribution line arrangement the semiconductor device supply voltage received from outside the semiconductor device, or to put on the first supply voltage distribution line a converted supply voltage having a value different from the semiconductor device supply voltage, wherein the voltage-to-voltage conversion circuit further comprises means selectively activatable for causing the first supply voltage distribution line arrangement to be electrically coupled to said second supply voltage distribution line arrangement.

Claims (68)

1. An integrated circuit, comprising:

a first node operable to receive a signal;

a second node operable to receive the signal;

a first coupler operable to couple the first node to a third node; and

a second coupler operable to couple the second node to the third node during a first operating condition and independent of the first coupler and operable to uncouple the first node from the third node during a second operating condition;

the integrated circuit further comprising:

circuitry coupled to the first node; and

wherein the second operating condition comprises the circuitry transferring data.

2. The integrated circuit of claim 1 wherein:

the first coupler is operable to couple the first node to the third node during the second operating condition; and

the second coupler is operable to couple the second node to the third node simultaneous to the first and third nodes being coupled to each other.

3. The integrated circuit of claim 2 wherein the second operating condition comprises the signal having a pre-established value.

4. The integrated circuit of claim 1 wherein:

the first coupler comprises a switch coupled between the first and third nodes; and

the second coupler comprises multiple switches coupled in parallel between the second and third nodes.

5. The integrated circuit of claim 1 wherein:

the first coupler comprises a transistor coupled between the first and third nodes; and

the second coupler comprises multiple transistors coupled in parallel between the second and third nodes.

6. The integrated circuit of claim 1 , further comprising:

circuitry coupled to the third node; and

wherein the first operating condition comprises the circuitry operating in a first pre-established operating mode.

7. The integrated circuit of claim 1 wherein the second coupler is operable to uncouple the first node from the third node during a second operating condition.

8. The integrated circuit of claim 1 , further comprising:

a periphery;

wherein the first node comprises a first supply node;

wherein the signal comprises a supply voltage;

wherein the second node comprises a second supply node;

wherein the first supply node comprises a first supply conductor disposed along a portion of the periphery;

wherein the second supply node comprises a second supply conductor disposed adjacent to the first supply conductor;

wherein the first coupler comprises a switch coupled between the first supply node and the third node; and

wherein the second coupler comprises multiple switches distributed along and coupled in parallel between the first and third nodes.

9. The integrated circuit of claim 1 wherein the first coupler is configured to couple the first node to the third node independently of an operating condition.

10. The integrated circuit of claim 1 wherein:

the first node comprises a first supply node;

the signal comprises a supply voltage; and

the second node comprises a second supply node.

11. An integrated circuit, comprising:

a first node operable to receive a signal;

a second node operable to receive the signal;

a first coupler operable to couple the first node to a third node; and

a second coupler operable to couple the second node to the third node during a first operating condition and independent of the first coupler and operable to operable to uncouple the first node from the third node during a second operating condition;

the integrated circuit further comprising:

circuitry coupled to the first node; and

wherein the second operating condition comprises the circuitry generating an unwanted signal on the first node.

12. A system, comprising:

a first integrated circuit, comprising,

a first node operable to receive a signal,

a second node,

a first coupler operable to couple the second node to the first node if the signal comprises a voltage above a voltage threshold, and

a second coupler operable to couple the second node to the first node during a first operating condition if the signal comprises a voltage below the voltage threshold and operable to decouple the second node from the first node during a second operating condition if the signal comprises a voltage below the voltage threshold; and

a second integrated circuit coupled to the first integrated circuit.

13. The system of claim 12 , wherein the second integrated circuit comprises a controller.

14. The system of claim 12 wherein the first and second integrated circuits are disposed on a same die.

15. The system of claim 12 wherein the first and second integrated circuits are disposed on respective dies.

16. A method, comprising:

enabling a first conductive path between first and second nodes; and

enabling a second conductive path via a switch between the first and second nodes during a first operating mode and independent of the enabling of the first conductive path; wherein:

enabling the first conductive path comprises enabling the first conductive path during a second operating mode such that circuitry coupled to the first node generates an unwanted signal on the first node; and

enabling the second conductive path comprises enabling the second conductive path simultaneous to the enabling of the first conductive path.

17. The method of claim 15 wherein:

enabling the first path comprises closing a first switch that is coupled between the first and second nodes; and

enabling the second path comprises closing a second switch that is coupled between the first and second nodes.

18. The method of claim 15 wherein:

enabling the first path comprises closing a first switch that is coupled between the first and second nodes; and

enabling the second path comprises closing second and third switches that are coupled in electrical parallel between the first and second nodes.

19. The method of claim 15 , further comprising disabling the second path during a second operating mode.

20. The method of claim 15 wherein enabling the first conductive path comprises enabling the first conductive path during all operating conditions.

21. The method of claim 15 , further comprising receiving a supply voltage on one of the first and second nodes.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 033812/0641 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
To: NUMONYX B.V.
Reel/Frame 033806/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2012
From: HYNIX SEMICONDUCTOR INC.
To: NUMONYX B.V.
Reel/Frame 029077/0288 →
CORRECTIVE ASSIGNMENT DOCUMENT TO ADD SECOND ASSIGNEE NAME PREVIOUSLY RECORDED REEL/FRAME 021736/0456 Recorded Feb 23, 2009
From: SEO, DONGHYUN; CHA, JAEYONG
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD; HYNIX SEMICONDUCTOR INC.
Reel/Frame 022298/0960 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2008
From: SEO, DONGHYUN; CHA, JAEYONG
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD
Reel/Frame 021736/0452 →