Printed wiring board and electronic apparatus including same
A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a position in proximity to the pair of signal pads, and a via configured to connect the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or via a lead wire led out from the ground pad. The via is located at a substantially equal position spaced away from the first signal pad and the second signal pad.
1. A printed wiring board, comprising:
a pair of signal pads including a first signal pad and a second signal pad formed at a corresponding end of a pair of signal trace patterns on a front side thereof and that transmit differential signals;
a ground pad formed at a position in proximity to the pair of signal pads; and
a via that connects the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or through a lead wire led out from the ground pad,
the via being substantially equidistant from the first signal pad and the second signal pad,
wherein the via is substantially equidistant from the first signal pad, the second signal pad and the ground pad and is connected to the ground pad through the lead wire.
2. The printed wiring board according to claim 1 , wherein both a first distance between the first signal pad and the via and a second distance between the second signal pad and the via correspond to (1/√2) times a pitch between the first signal pad and the second signal pad.
3. The printed wiring board according to claim 2 , wherein a third distance between the ground pad and the via corresponds to (1/√2) times a pitch between the first signal pad and the second signal pad.
4. The printed wiring board according to claim 1 , wherein the ground pad comprises multiple ground pads and the lead wire comprises multiple lead wires corresponding to the multiple ground pads,
the via being substantially equidistant from the first signal pad, the second signal pad, and the multiple ground pads, and connected to each of the ground pads through each of the corresponding lead wires.
5. The printed wiring board according to claim 1 , wherein multiple pads including the first signal pad, the second signal pad, and the ground pad are arranged in a zigzag line equidistant from each other.
6. The printed wiring board according to claim 1 , wherein multiple pads including the first signal pad, the second signal pad, and the ground pad are arranged in a square-shaped grid equidistant from each other.
7. The printed wiring board according to claim 1 , wherein multiple pads, including the first signal pad, the second signal pad, and the ground pad, are formed as a pad group for mounting an electronic component with a differential signal terminal.
8. The printed wiring board according to claim 1 , wherein the via is formed as a via hole by a through-hole process.
9. The printed wiring board according to claim 1 , wherein the via is formed as a conductive via including a conductive material.
10. The printed wiring board according to claim 1 , wherein the ground pattern extends immediately below the ground pad.
11. A printed wiring board, comprising:
a pair of signal pads including a first signal pad and a second signal pad formed at a corresponding end of a pair of signal trace patterns on a front side thereof and that transmit differential signals;
a ground pad formed at a position in proximity to the pair of signal pads; and
a via that connects the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or through a lead wire led out from the ground pad,
the via being substantially equidistant from the first signal pad and the second signal pad,
wherein the ground pad comprises multiple ground pads, the lead wire comprises multiple lead wires, and the via comprises multiple vias that connect each of the multiple ground pads through each of the corresponding lead wires to the ground pattern formed either on the back side or on the inner layer of the printed wiring board through each of the lead wires led out from the corresponding ground pad,
a first via of the multiple vias being located closest to the first signal pad by a first distance and a second via of the multiple vias being located closest to the second signal pad by a second distance substantially equal to the first distance.
12. The printed wiring board according to claim 11 , wherein the first via closest to the first signal pad is connected to a first ground pad of the multiple ground pads and the second via closest to the second signal pad is connected to a second ground pad of the multiple ground pads,
the first via separated from the first ground pad by a third distance and the second via separated from the second ground pad by a fourth distance substantially equal to the third distance.
13. The printed wiring board according to claim 11 , wherein both the first distance and the second distance correspond to (1/√2) times a pitch between the first signal pad and the second signal pad.
14. The printed wiring board according to claim 13 , wherein both the third distance and the fourth distance correspond to (1/√2) times the pitch between the first signal pad and the second signal pad.
15. An electronic apparatus, comprising:
a printed wiring board comprising:
a pair of signal pads including a first signal pad and a second signal pad formed at a corresponding end of a pair of signal trace patterns on a front side thereof and configured to transmit differential signals;
a ground pad formed at a position in proximity to the pair of signal pads; and
a via configured to connect the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or through a lead wire led out from the ground pad,
the via being substantially equidistant from the first signal pad and the second signal pad,
wherein the ground pad comprises multiple ground pads, the lead wire comprises multiple lead wires, and the via comprises multiple vias configured to connect each of the multiple ground pads through each of the corresponding lead wires to the ground pattern formed either on the back side or on the inner layer of the printed wiring board through each of the lead wires led out from the corresponding ground pad,
a first via of the multiple vias being located closest to the first signal pad by a first distance and a second via of the multiple vias being located closest to the second signal pad by a second distance substantially equal to the first distance.
16. The electronic apparatus according to claim 15 , wherein the first via closest to the first signal pad is connected to a first ground pad of the multiple ground pads and the second via closest to the second signal pad is connected to a second ground pad of the multiple ground pads,
the first via separated from the first ground pad by a third distance and the second via separated from the second ground pad by a fourth distance substantially equal to the third distance.