Contact efuse structure
View Patent ↗A contact efuse structure includes a silicon layer and a contact contacting the silicon layer with one end. When a voltage is applied to the contact, a void is formed at the end of the contact, and thus the contact is open. Such structure may be utilized in an efuse device or a read only memory. A method of making a contact efuse device and a method of making a read only memory are also disclosed.
1. A contact efuse structure, comprising:
a silicon layer; and
a contact comprising a first end and a second end, the contact contacting the silicon layer with the first end, wherein after the contact is applied with a voltage, a void is formed at the first end to allow the contact to be open, and the void is between the contact and the silicon layer.
2. The structure of claim 1 , wherein the silicon layer comprises polysilicon material.
3. The structure of claim 1 , wherein the silicon layer comprises a dopant.
4. The structure of claim 1 , wherein the contact comprises tungsten, tantalum, tantalum nitride, titanium, titanium nitride, aluminum, or copper.
5. The structure of claim 1 , wherein the contact comprises a metal plug and a barrier layer surrounding the metal plug.
6. The structure of claim 1 used in a contact efuse device, wherein the contact efuse device comprises:
an anode;
the silicon layer comprising a polysilicon layer as a cathode;
a fuse link connecting the anode and the cathode; and
the contact disposed on the cathode, for accepting the voltage to form the void and to be open.
7. The structure of claim 1 used in a read only memory, wherein a unit structure of the read only memory includes:
a semiconductor substrate;
a gate structure on the semiconductor substrate;
the silicon layer being a doping region in the semiconductor substrate at a side of the gate structure; and
the contact on the doping region for accepting the voltage to form the void and be open.
8. The structure of claim 1 used in a read only memory, wherein a unit structure of the read only memory includes:
a semiconductor substrate;
a gate structure on the semiconductor substrate, an upper portion of the gate structure comprising a polysilicon layer;
a doping region in the semiconductor substrate at a side of the gate structure; and
the contact on the polysilicon layer of the gate structure for accepting the voltage to form the void and be open.
9. A contact efuse structure, comprising:
an efuse pattern layer comprising a cathode, an anode and a fuse link connecting the anode and the cathode, wherein the cathode comprises a silicon layer, and the anode comprises a metal silicide layer;
a first contact comprising a first end and a second end, the first contact contacting the silicon layer of the cathode with the first end; and
a second contact contacting the metal silicide layer of the anode.
10. The contact efuse structure of claim 9 , wherein a salicide block layer is disposed on the silicon layer of the cathode.
11. The structure of claim 9 , wherein the silicon layer comprises polysilicon material.
12. The structure of claim 9 , wherein the silicon layer comprises a dopant.
13. The structure of claim 9 , wherein the first contact and the second contact comprise tungsten, tantalum, tantalum nitride, titanium, titanium nitride, aluminum, or copper.
14. The structure of claim 9 , wherein the first contact and the second contact comprise a metal plug and a barrier layer surrounding the metal plug.