IP Library Granted Patent US 8,044,861
Granted Patent B2
US 8,044,861 · App. 12/164,756 · Granted Oct 25, 2011

Electronic device with edge surface antenna elements and related methods

Assignee: Harris Corporation
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Quick Facts
Patent No.
US 8,044,861
App. No.
12/164,756
Granted
Oct 25, 2011
Kind
B2
Abstract

An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Claims (29)

1. An electronic device comprising:

a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces;

wireless processing circuitry on at least one of the opposing major surfaces; and

an antenna element on at least one of the edge surfaces;

said multilayer circuit board comprising an internal conductive trace and a conductive via coupled thereto, said internal conductive trace and said conductive via coupling said antenna element to said wireless processing circuitry.

2. The electronic device according to claim 1 wherein said antenna element comprises:

a feed portion coupled to said internal conductive trace; and

a radiative portion coupled to said feed portion.

3. The electronic device according to claim 1 wherein said antenna element comprises a dipole antenna element.

4. The electronic device according to claim 1 wherein said antenna element comprises a monopole antenna element.

5. The electronic device according to claim 1 wherein said antenna element comprises a patch antenna element.

6. The electronic device according to claim 1 wherein said multilayer circuit board comprises a ground plane therein extending parallel to the opposing major surfaces.

7. The electronic device according to claim 1 wherein said wireless processing circuitry comprises at least one of an amplifier, a phase shifter, and a filter.

8. The electronic device according to claim 1 wherein said wireless processing circuitry is on a first one of the opposing major surfaces; and further comprising additional circuitry on a second one of the opposing major surfaces and being coupled to said wireless processing circuitry by said conductive via.

9. The electronic device according to claim 8 wherein said conductive via comprises a plurality thereof extending between the opposing major surfaces for coupling said wireless processing circuitry to said additional circuitry.

10. A phased array antenna comprising:

a plurality of multilayer circuit boards arranged in side-by-side orientation;

each multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, and comprising

wireless processing circuitry on at least one of the opposing major surfaces,

an antenna element on at least one of the edge surfaces, and

an internal conductive trace and a conductive via coupled thereto, said internal conductive trace and said conductive via coupling said antenna element to said wireless processing circuitry.

11. The phased array antenna according to claim 10 wherein said antenna element comprises:

a feed portion coupled to said internal conductive trace; and

a radiative portion coupled to said feed portion.

12. The phased array antenna according to claim 10 wherein said antenna element comprises at least one of a patch antenna element, a dipole antenna element, and a monopole antenna element.

13. The phased array antenna according to claim 10 wherein each multilayer circuit board further comprises a ground plane therein extending parallel to the opposing major surfaces.

14. The phased array antenna according to claim 10 wherein said wireless processing circuitry is on a first one of the opposing major surfaces;

and further comprising additional circuitry on a second one of the opposing major surfaces and being coupled to said wireless processing circuitry by said conductive via.

15. The phased array antenna according to claim 14 wherein said conductive via comprises a plurality thereof extending between the opposing major surfaces for coupling said wireless processing circuitry to said additional circuitry.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2008
From: PEDERSEN, ANDERS P.; ROBISON, DANIEL A.; MAST, ALAN
To: HARRIS CORPORATION
Reel/Frame 021192/0943 →
Continuity (1)
Related Publication 20090322620A1 · Dec 31, 2009