IP Library Granted Patent US 8,053,269
Granted Patent B2
US 8,053,269 · App. 12/795,771 · Granted Nov 8, 2011

Method of forming display device that includes removing mask to form opening in insulating film

Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 8,053,269
App. No.
12/795,771
Granted
Nov 8, 2011
Kind
B2
Abstract

To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the mask, removing the mask to form an insulating layer having an opening; and forming a conductive film in the opening so as to be in contact with the exposed conductive layer, whereby the conductive layer and the conductive film can be electrically connected through the insulating layer. The shape of the opening reflects the shape of the mask. A mask having a columnar shape (e.g., a prism, a cylinder, or a triangular prism), a needle shape, or the like can be used.

Claims (54)

1. A method of fabricating a display device comprising the steps of:

providing a mask having a columnar shape on a conductive layer;

forming an insulating film over the conductive layer provided with the mask;

forming an opening in the insulating film by removing the mask;

forming a first electrode layer in the opening so as to be in contact with the conductive layer;

forming a second electrode layer over the first electrode layer; and

providing an electrophoretic element between the first electrode layer and the second electrode layer.

2. The method of fabricating a display device according to claim 1 , wherein the insulating film is formed by an evaporation method, a sputtering method, or a chemical vapor deposition method.

3. The method of fabricating a display device according to claim 1 , wherein the mask has a plurality of projecting portions on a supporting substrate.

4. The method of fabricating a display device according to claim 3 , wherein the supporting substrate has a plurality of openings.

5. The method of fabricating a display device according to claim 1 , wherein the mask is removed by etching.

6. The method of fabricating a display device according to claim 1 , wherein the conductive layer is transferred to a substrate by laser irradiation.

7. A method of fabricating a display device comprising the steps of:

forming a thin film transistor including a semiconductor layer, a source electrode layer, and a drain electrode layer;

providing a mask having a columnar shape on the source electrode layer or the drain electrode layer;

forming an insulating film over the thin film transistor having the source electrode layer or the drain electrode layer provided with the mask;

forming an opening in the insulating film by removing the mask;

forming a first electrode layer in the opening so as to be in contact with the source electrode layer or the drain electrode layer;

forming a second electrode layer over the first electrode layer; and

providing an electrophoretic element between the first electrode layer and the second electrode layer.

8. The method of fabricating a display device according to claim 7 , wherein the insulating film is formed by an evaporation method, a sputtering method, or a chemical vapor deposition method.

9. The method of fabricating a display device according to claim 7 , wherein the mask has a plurality of projecting portions on a supporting substrate.

10. The method of fabricating a display device according to claim 9 , wherein the supporting substrate has a plurality of openings.

11. The method of fabricating a display device according to claim 7 , wherein the mask is removed by etching.

12. The method of fabricating a display device according to claim 7 , wherein the source electrode layer or the drain electrode layer is transferred to a substrate by laser irradiation.

13. The method of fabricating a display device according to claim 7 , wherein the semiconductor layer comprises an amorphous semiconductor.

14. The method of fabricating a display device according to claim 7 , wherein the semiconductor layer comprises an organic semiconductor.

15. A method of fabricating a display device comprising the steps of:

providing a mask having a columnar shape on a conductive layer;

forming an insulating film over the conductive layer provided with the mask;

forming an opening in the insulating film by removing the mask;

forming a first electrode layer in the opening so as to be in contact with the conductive layer;

forming a second electrode layer over the first electrode layer; and

providing a spherical particle colored in black and white between the first electrode layer and the second electrode layer.

16. The method of fabricating a display device according to claim 15 , wherein the insulating film is formed by an evaporation method, a sputtering method, or a chemical vapor deposition method.

17. The method of fabricating a display device according to claim 15 , wherein the mask has a plurality of projecting portions on a supporting substrate.

18. The method of fabricating a display device according to claim 17 , wherein the supporting substrate has a plurality of openings.

19. The method of fabricating a display device according to claim 15 , wherein the mask is removed by etching.

20. The method of fabricating a display device according to claim 15 , wherein the conductive layer is transferred to a substrate by laser irradiation.

21. A method of fabricating a display device comprising the steps of:

forming a thin film transistor including a semiconductor layer, a source electrode layer, and a drain electrode layer;

providing a mask having a columnar shape on the source electrode layer or the drain electrode layer;

forming an insulating film over the thin film transistor having the source electrode layer or the drain electrode layer provided with the mask;

forming an opening in the insulating film by removing the mask;

forming a first electrode layer in the opening so as to be in contact with the source electrode layer or the drain electrode layer;

forming a second electrode layer over the first electrode layer; and

providing a spherical particle colored in black and white between the first electrode layer and the second electrode layer.

22. The method of fabricating a display device according to claim 21 , wherein the insulating film is formed by an evaporation method, a sputtering method, or a chemical vapor deposition method.

23. The method of fabricating a display device according to claim 21 , wherein the mask has a plurality of projecting portions on a supporting substrate.

24. The method of fabricating a display device according to claim 23 , wherein the supporting substrate has a plurality of openings.

25. The method of fabricating a display device according to claim 21 , wherein the mask is removed by etching.

26. The method of fabricating a display device according to claim 21 , wherein the source electrode layer or the drain electrode layer is transferred to a substrate by laser irradiation.

27. The method of fabricating a display device according to claim 21 , wherein the semiconductor layer comprises an amorphous semiconductor.

28. The method of fabricating a display device according to claim 21 , wherein the semiconductor layer comprises an organic semiconductor.

Priority Claims (1)
JP 2006-231956 · Aug 29, 2006 · national
Continuity (2)
Continuation 11889546 · Aug 14, 2007
Related Publication 20100248405A1 · Sep 30, 2010