IP Library Granted Patent US 8,058,966
Granted Patent B2
US 8,058,966 · App. 10/562,277 · Granted Nov 15, 2011

PTC thermistor and method for protecting circuit

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Quick Facts
Patent No.
US 8,058,966
App. No.
10/562,277
Granted
Nov 15, 2011
Kind
B2
Abstract

A PTC thermistor provided with a conductive member having PTC characteristics and two electrodes each placed in two different locations on the conductive member. The, conductive member and at least one of the two electrodes is bonded via an adhesive which has conductivity and which at the same time deteriorates in an overheated state and irreversibly increases the electrical resistance.

Claims (13)

1. A polymeric PTC thermistor comprising:

a conductive member comprising a conductive polymer having PTC characteristics; and

two electrodes each placed in two different locations on the conductive member;

wherein the conductive member and at least one of the two electrodes are bonded via an adhesive which (i) comprises a synthetic resin, (ii) has conductivity, and (iii) deteriorates in an overheated state in a temperature range in which the conductive polymer thermally expands and irreversibly increases the electrical resistance.

2. A thermistor according to claim 1 , wherein both of the two electrodes are bonded via the adhesive.

3. A thermistor according to claim 1 , wherein another of the two electrodes is bonded to the conductive member via a weld.

4. A thermistor according to claim 1 , wherein another of the two electrodes is bonded to the conductive member via solder.

5. A thermistor according to claim 1 , wherein the synthetic resin comprises a thermoplastic resin.

6. A thermistor according to claim 5 , wherein the thermoplastic resin comprises vinyl acetate resin, polyvinyl alcohol resin, acrylic resin, vinyl urethane resin, or mixtures thereof.

7. A thermistor according to claim 1 , wherein the synthetic resin comprises a thermosetting resin.

8. A thermistor according to claim 7 , wherein the thermosetting resin comprises urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, silicone resin, α-olefin maleic acid anhydride resin, polyamide resin, polyimide resin, or mixtures thereof.

9. A thermistor according to claim 1 , wherein the adhesive comprises a conductive powder.

10. A thermistor according to claim 9 , wherein the conductive powder comprises gold, silver, nickel, or copper.

Assignments (2)
CHANGE OF NAME Recorded Jul 13, 2016
From: TYCO ELECTRONICS JAPAN G.K.
To: LITTELFUSE JAPAN G.K.
Reel/Frame 039149/0656 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2006
From: KOYAMA, HIROYUKI
To: TYCO ELECTRONICS RAYCHEM K.K.
Reel/Frame 017144/0886 →
Priority Claims (1)
JP 2003-178662 · Jun 23, 2003 · national
Continuity (1)
Related Publication 20070057759A1 · Mar 15, 2007