Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
1. A method of making an RFID device comprising:
providing a substrate web having antenna structures;
placing a chip having an upper surface on top of a the substrate;
softening a region of the substrate by applying heat to the substrate;
deforming said region of the substrate;
embedding the chip into the substrate while the substrate is at an elevated temperature such that the upper surface of the chip is substantially level with the substrate;
cooling the substrate to partially encase the chip within the substrate; and
coupling the upper surface of the chip to one of the antenna structures on the substrate to form a RFID inlay having substantially planar upper and lower surfaces.
2. A method as set forth in claim 1 , wherein the placing a chip on a substrate includes placing a chip that is part of an RFID interposer that includes interposer leads mounted to the chip.
3. A method as set forth in claim 1 , wherein the placing a chip on the substrate includes placing the chip on the substrate that is a thermoplastic material.
4. A method as set forth in claim 1 , wherein the applying heat to the substrate includes applying electromagnetic radiation to at least one of the chip and the substrate.
5. A method as set forth in claim 4 , wherein the applying electromagnetic radiation includes applying thermal radiation.
6. A method as set forth in claim 1 , wherein the embedding includes pressing the chip into the substrate with rollers.
7. A method as set forth in claim 1 , wherein the coupling includes printing a conductive material onto the substrate.
8. A method as set forth in claim 1 , wherein the chip and substrate have a uniform profile.
9. A method as set forth in claim 8 , wherein the chip is provided with bumps that extend upwardly from the uniform profile.
10. A method as set forth in claim 9 , wherein the bumps are connected to the antenna.