IP Library Granted Patent US 8,070,899
Granted Patent B2
US 8,070,899 · App. 12/868,456 · Granted Dec 6, 2011

Method and apparatus for positioning layers within a layered heater system

Assignee: Watlow Electric Manufacturing Company
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Quick Facts
Patent No.
US 8,070,899
App. No.
12/868,456
Granted
Dec 6, 2011
Kind
B2
Abstract

A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

Claims (39)

1. A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device comprising:

locating the tape preform in a predetermined position;

translating at least one of a positioning device, the resistive device substrate, and the tape preform relative to each other until a portion of the positioning device engages the tape preform;

continuing the translation until the tape preform engages the resistive device substrate; and

continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate.

2. The method according to claim 1 , wherein the portion of the positioning device that first engages the tape preform and the components of the positioning device that progressively translate around the resistive device substrate move dependently with each other.

3. The method according to claim 1 , wherein the resistive device substrate is translatable with the positioning device.

4. The method according to claim 1 , wherein the components of the positioning device that progressively translate around the resistive device substrate are pivotable at one end and move the portion of the positioning device that first engages the tape preform at another end while progressively translating around the resistive device substrate.

5. The method according to claim 1 further comprising translating a press onto the tape preform and the resistive device substrate while retracting the positioning device away from the resistive device substrate.

6. The method according to claim 1 , wherein translating at least one of the positioning device, the resistive device substrate, and the tape preform relative to each other is accomplished using a controller.

7. The method according to claim 1 further comprising holding the tape preform with cutouts located on opposed holding members prior to engaging the tape preform with the resistive device substrate.

8. The method according to claim 1 further comprising laminating the tape preform onto the resistive device substrate.

9. The method according to claim 1 further comprising forming a resistive layer on the tape preform.

10. The method according to claim 9 further comprising forming a protective layer on the resistive layer.

11. The method of claim 1 further comprising enclosing the resistive device substrate and the tape preform in a pressurized vessel.

12. The method of claim 11 further comprising applying a predetermined cycle of pressure, temperature, and time to the resistive device substrate and the tape preform.

13. The method of claim 12 further comprising firing the resistive device substrate and the tape preform in a furnace.

14. A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device comprising:

locating the tape preform in a predetermined position;

activating a controller to translate at least one of a positioning device, the resistive device substrate, and the tape preform relative to each other until a portion of the positioning device engages the tape preform; and

continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and position the tape preform onto the resistive device substrate.

15. The method according to claim 14 , further comprising activating the controller to translate at least one of a press and the resistive device substrate relative to each other, and activating the controller to translate the positioning device away from the resistive device substrate.

16. The method of claim 14 , wherein the controller translates a base member to which the positioning device is attached and the positioning device simultaneously to position the tape preform onto the resistive device substrate.

17. The method according to claim 14 further comprising holding the tape preform with cutouts located on opposed holding members prior to engaging the tape preform with the resistive device substrate.

18. The method according to claim 14 further comprising laminating the tape preform onto the resistive device substrate.

19. The method according to claim 14 further comprising forming a resistive layer on the tape preform.

20. The method of claim 14 further comprising enclosing the resistive device substrate and the tape preform in a pressurized vessel.

21. The method of claim 20 further comprising applying a predetermined cycle of pressure, temperature, and time to the resistive device substrate and the tape preform.

22. The method of claim 21 further comprising firing the resistive device substrate and the tape preform in a furnace.

23. A method of creating a layered resistive device having a tape preform layer, the method comprising:

locating the tape preform in a predetermined position;

translating at least one of a positioning device, a substrate, and the tape preform relative to each other until a portion of the positioning device engages the tape preform;

continuing the translation such that a component of the positioning device progressively translates around the substrate and positions the tape preform onto the substrate; and

applying a predetermined cycle of pressure, temperature, and time to the substrate and the tape preform.

24. The method according to claim 23 further comprising laminating the tape preform onto the substrate.

25. The method according to claim 23 further comprising forming a resistive layer on the tape preform.

26. The method of claim 23 further comprising enclosing the substrate and the tape preform in a pressurized vessel.

27. The method of claim 23 further comprising firing the substrate and the tape preform in a furnace.

28. The method according to claim 23 , wherein translating at least one of the positioning device, the substrate, and the tape preform relative to each other is accomplished using a controller.

Assignments (2)
PATENT SECURITY AGREEMENT (SHORT FORM) Recorded Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2017
From: FORBIS, LARRY; MILLER, JASON; GAULKE, KEN; PRIVETT, ANGIE; BRUMMELL, ROGER; LAMANTIA, TOM; TISCHER, JULIE
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 043435/0412 →
Continuity (2)
Division 12098827 · Apr 7, 2008
Related Publication 20100319186A1 · Dec 23, 2010