Semiconductor device structures and methods of forming semiconductor structures
View Patent ↗A method of patterning a semiconductor film is described. According to an embodiment of the present invention, a hard mask material is formed on a silicon film having a global crystal orientation wherein the semiconductor film has a first crystal plane and second crystal plane, wherein the first crystal plane is denser than the second crystal plane and wherein the hard mask is formed on the second crystal plane. Next, the hard mask and semiconductor film are patterned into a hard mask covered semiconductor structure. The hard mask covered semiconductor structured is then exposed to a wet etch process which has sufficient chemical strength to etch the second crystal plane but insufficient chemical strength to etch the first crystal plane.
1. An integrated circuit comprising:
a first nonplanar transistor having a first semiconductor body comprising V-notched sidewalls above a substrate having a top plane, wherein charge migration in the first semiconductor body is along a first direction; and
a second nonplanar transistor having a second semiconductor body comprising inwardly tapered sidewalls above the substrate, wherein the inwardly tapered sidewalls each taper inward from the top of the second semiconductor body at an angle of approximately 62.5 degrees, wherein charge migration in the second semiconductor body is along a second direction, and wherein, relative to the top plane of the substrate, the second direction is no parallel to the first direction.
2. The integrated circuit of claim 1 , wherein, relative to the top plane of the substrate the first direction is approximately 45 degrees with respect to the second direction.
3. The integrated circuit of claim 1 , wherein the first nonplanar transistor is an n type field effect transistor, wherein the first semiconductor body is formed from a single crystalline silicon film, and wherein the first direction is parallel to a <100> plane of the single crystalline silicon film.
4. The integrated circuit of claim 1 , wherein the second nonplanar transistor is a p type field effect transistor, wherein the second semiconductor body is a single crystalline silicon film, and wherein the second direction is parallel to a <110> plane.
5. The integrated circuit of claim 1 , wherein the second nonplanar transistor is up type field effect transistor, wherein the second semiconductor body is formed from a single crystalline silicon film, wherein the second direction is parallel to a <110> plane of the silicon film, wherein the first nonplanar transistor is an n type field effect transistor, wherein the first semiconductor body is a single crystalline silicon film, and wherein the first direction is parallel to a <100> plane.
6. The integrated circuit of claim 1 , wherein each sidewall is flat from the top of the second semiconductor body to the bottom of the second semiconductor body.
7. The integrated circuit of claim 1 , wherein the V-notched sidewalls each notch inward from the sides of the first semiconductor body at an angle of approximately 55 degrees.
8. The integrated circuit of claim 7 , wherein each sidewall is flat from the top of the first semiconductor body to the center of the V-notch, and is flat from the center of the V-notch to the bottom of the first semiconductor body.
9. The integrated circuit of claim 1 , wherein charge migration in the second semiconductor body is along a direction perpendicular to the inwardly tapered sidewalls.
10. The integrated circuit of claim 1 , wherein charge migration in the first semiconductor body is along a direction perpendicular to the V-notched sidewalls.
11. A nonplanar transistor, comprising:
a semiconductor body comprising V-notched sidewalls, wherein charge migration in the semiconductor body is along a direction perpendicular to the V-notched sidewalls, and wherein the V-notched sidewalls each notch inward from the sides of the semiconductor body at an angle of approximately 55 degrees; and
a gate electrode disposed over the semiconductor body and orthogonal to the direction of charge migration.
12. The nonplanar transistor of claim 11 , wherein each sidewall is flat from the top of the semiconductor body to the center of the V-notch, and is flat from the center of the V-notch to the bottom of the semiconductor body.
13. The nonplanar transistor of claim 11 , wherein the nonplanar transistor is an n type field effect transistor, wherein the semiconductor body is formed from a single crystalline silicon film, and wherein the direction perpendicular to the sidewalls is parallel to a <100> plane of the single crystalline silicon film.
14. An integrated circuit comprising:
a first nonplanar transistor having a first semiconductor body comprising V-notched sidewalk above a substrate having a top plane, wherein the V-notched sidewalls each notch inward from the sides of the first semiconductor body at an angle of approximately 55 degrees, and wherein charge migration in the first semiconductor body is along a first direction; and
a second nonplanar transistor having a second semiconductor body comprising inwardly tapered sidewalls above the substrate, wherein charge migration in the second semiconductor body is along a second direction, and wherein, relative to the top plane of the substrate, the second direction is not parallel to the first direction.
15. The integrated circuit of claim 14 , wherein, relative to the top plane of the substrate, the first direction is approximately 45 degrees with respect to the second direction.
16. The integrated circuit of claim 14 , wherein the first nonplanar transistor is an n type field effect transistor, wherein the first semiconductor body is formed from a single crystalline silicon film, and wherein the first direction is parallel to a <100> plane of the single crystalline silicon film.
17. The integrated circuit of claim 14 , wherein the second nonplanar transistor is a p type field effect transistor, wherein the second semiconductor body is a single crystalline silicon film, and wherein the second direction is parallel to a <110> plane.
18. The integrated circuit of claim 14 , wherein the second nonplanar transistor is a p type field effect transistor, wherein the second semiconductor body is formed from a single crystalline silicon film, wherein the second direction is parallel to a <110> plane of the silicon film, wherein the first nonplanar transistor is an n type field effect transistor, wherein the first semiconductor body is a single crystalline silicon film, and wherein the first direction is parallel to a <100> plane.
19. The integrated circuit of claim 14 , wherein charge migration in the second semiconductor body is along a direction perpendicular to the inwardly tapered sidewalls.
20. The integrated circuit of claim 14 , wherein charge migration in the first semiconductor body is along a direction perpendicular to the V-notched sidewalls.