IP Library Granted Patent US 8,074,547
Granted Patent B2
US 8,074,547 · App. 11/657,274 · Granted Dec 13, 2011

Automatic slicing apparatus

Assignee: Seiko Instruments Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,074,547
App. No.
11/657,274
Granted
Dec 13, 2011
Kind
B2
Abstract

An automatic slicing apparatus reduces the likelihood of failure to make a sliced piece specimen even if continuously operated. The apparatus, on the basis of an exchange command signal, detaches a sample block attached to a cutting base and attaches a new sample block to the cutting base. The apparatus cuts a sliced piece of a predetermined thickness by moving a knife with respect to the sample block having been attached to the cutting base. The apparatus also observes the sliced piece having been cut and judges the sliced piece by comparing an observation data obtained by the observation means and a sample block cut face data. When the apparatus judges that the sliced piece is good, the apparatus transmits an exchange command signal.

Claims (13)

1. An automatic slicing apparatus comprising:

a sample block attaching/detaching device which, on the basis of an exchange command signal, detaches a sample block attached to a cutting base and attaches a new sample block to the cutting base;

a cutting device which cuts a sliced piece of a predetermined thickness by relatively moving a knife with respect to the sample block having been attached to the cutting base;

an observation device observing the sliced piece having been cut;

an evaluation device which judges whether the sliced piece is good or not good by an observation data having been obtained by the observation device and which, when there has been judged that the sliced piece is good, transmits an exchange command signal to the effect that the sample block is to be exchanged to the sample block attaching/detaching device;

a water tank that extends the sliced piece having been cut; and

a carrier device carrying the sliced piece having been cut such that the sliced piece having been cut is immersed in the water tank,

wherein the observation data is a picture data obtained clearly by taking by an epi-illumination system applying a collimate light parallel to a normal of a surface of a mirror-reflecting liquid medium in the water tank, when the sliced piece has been extended, an image of the sliced piece having been disposed on a surface of a mirror-reflecting liquid medium in the water tank, together with the liquid medium around the sliced piece.

2. An automatic slicing apparatus according to claim 1 , wherein the evaluation device judges whether the sliced piece is good or not good by a light-dark data having been obtained by binarization-processing the picture data on the basis of a luminance information.

3. An automatic slicing apparatus according to claim 1 , wherein the evaluation device judges whether the sliced piece is good or not good by comparing the observation data having been obtained by the observation device and a sample block cut face data having been previously inputted and, when there has been judged that the sliced piece is good, transmits the exchange command signal to the effect that the sample block is to be exchanged to the sample block attaching/detaching device.

4. An automatic slicing apparatus according to claim 3 , wherein the evaluation device judges whether the sliced piece is good or not good by comparing a light-dark data having been obtained by binarization-processing the picture data on the basis of a luminance information and the sample block cut face data.

5. An automatic slicing apparatus according to claim 4 , wherein, in the evaluation device, when comparing the light-dark data and the sample block cut face data, a virtual sliced piece picture obtained from the light-dark data and a sample block cut face picture obtained from the sample block cut face data are compared with at least one element among an area element, a position element of barycenter, and a pattern matching element.

6. An automatic slicing apparatus according to claim 1 , wherein the epi-illumination system comprises a face light emission source making a collimate light, and a half mirror which reflects the collimate light having been irradiated from the face light emission source to the sliced pieced side, and through which the reflected light from the sliced piece permeates with a peripheral medium.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2012
From: SEIKO INSTRUMENTS INC.
To: SAKURA FINETEK JAPAN CO., LTD.
Reel/Frame 028119/0377 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2007
From: ITO, TETSUMASA; MIYATANI, TATSUYA; FUJUMOTO, KOJI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 019199/0296 →
Priority Claims (1)
JP 2006-016156 · Jan 25, 2006 · national
Continuity (1)
Related Publication 20070180965A1 · Aug 9, 2007