Thermal interface with non-tacky surface
View Patent ↗A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.
1. A conformable thermal interface member, comprising:
a body having:
(a) a bulk layer having a modulus of less than about 10 6 Pa, and a thermal conductivity of at least about 0.5 W/m·K; and
(b) a surface layer disposed on said bulk layer, said surface layer defining an exterior engagement surface of said body and having:
(i) a maximum cross sectional thickness of less than about 10 μm;
(ii) a thermal conductivity along at least a thickness dimension of said surface layer of at least about 50 W/m·K; and
(iii) a melting point exceeding a solder reflow temperature.
2. A conformable thermal interface member as in claim 1 wherein said surface layer has a melting point of at least about 300° C.
3. A conformable thermal interface member as in claim 1 wherein said surface layer includes a metal or metal complex.