IP Library Granted Patent US 8,077,267
Granted Patent B2
US 8,077,267 · App. 12/126,280 · Granted Dec 13, 2011

TFT LCD array substrate wherein an air gap is formed between the insulating layer and the active layer and method of manufacturing thereof

Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
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Quick Facts
Patent No.
US 8,077,267
App. No.
12/126,280
Granted
Dec 13, 2011
Kind
B2
Abstract

Provided are a thin film transistor liquid crystal array substrate and a method of manufacturing the same. The thin film transistor liquid crystal display array substrate includes: a substrate, a gate scanning line and a signal scanning line formed on the substrate and intersecting each other, an insulating layer and an active layer formed between the gate scanning line and the signal scanning line, wherein an air gap is formed between the insulating layer and the active layer at the intersection of the gate scanning line and the signal scanning line.

Claims (53)

1. A thin film transistor liquid crystal display (TFT LCD) array substrate, comprising:

a substrate,

a gate scanning line and a signal scanning line formed on the substrate and intersecting each other, and

an insulating layer and an active layer formed at the intersection of the gate scanning line and the signal scanning line wherein at least a portion of the insulating layer and at least a portion of the active layer are layered between the gate scanning line and the signal scanning line,

wherein an air gap is formed between the insulating layer and the active layer at the intersection of the gate scanning line and the signal scanning line.

2. The TFT LCD array substrate of claim 1 , wherein the width of the air gap is equal to the width of the active layer in the direction of the gate scanning line.

3. A method of manufacturing the TFT LCD array substrate of claim 2 , the method comprising:

depositing a first metal film on the substrate and patterning the first metal film to form a gate scanning line;

depositing an insulating layer on the substrate;

applying a photoresist layer on the substrate and patterning the photoresist layer so that the photoresist is remained at the intersection of the gate scanning line and a signal scanning line to be formed;

depositing an active covering layer on the substrate and patterning the active covering layer so as to form an active layer partially covering the remained photoresist in a direction of the gate scanning line;

lifting off the remained photoresist between the insulating layer and the active layer, whereby an air gap is formed between the insulating layer and the active layer; and

depositing a second metal film on the substrate and patterning the second metal film to form the signal scanning line.

4. The method of claim 3 , wherein applying a photoresist layer on the substrate and patterning the photoresist layer comprises: in the direction perpendicular to the gate scanning line, the width of the remained photoresist is larger than that of the gate scanning layer.

5. The method of claim 3 , wherein depositing an active covering layer on the substrate and patterning the active covering layer comprises:

in the direction of the gate scanning line, the width of the active layer is less than that of the remained photoresist.

6. The TFT LCD array substrate of claim 1 , wherein the width of the air gap is equal to the width of the gate scanning line in the direction of the signal scanning line.

7. A method of manufacturing the TFT LCD array substrate of claim 1 , the method comprising:

depositing a first metal film on the substrate and patterning the first metal film to form a gate scanning line;

depositing an insulating layer on the substrate;

applying a photoresist layer on the substrate and patterning the photoresist layer so that the photoresist is remained at the intersection of the gate scanning line and a signal scanning line to be formed;

depositing an active covering layer on the substrate and patterning the active covering layer so as to form an active layer partially covering the remained photoresist in a direction of the gate scanning line;

lifting off the remained photoresist between the insulating layer and the active layer, whereby an air gap is formed between the insulating layer and the active layer; and

depositing a second metal film on the substrate and patterning the second metal film to form the signal scanning line.

8. The method of claim 7 , wherein applying a photoresist layer on the substrate and patterning the photoresist layer comprises:

in the direction perpendicular to the gate scanning line, the width of the remained photoresist is larger than that of the gate scanning layer.

9. The method of claim 7 , wherein depositing an active covering layer on the substrate and patterning the active covering layer comprises:

in the direction of the gate scanning line, the width of the active layer is less than that of the remained photoresist.

10. The TFT LCD array substrate of claim 1 , wherein the width of the air gap is equal to one selected from the width of the active layer in the direction of the gate scanning line and the width of the gate scanning line in the direction of the signal scanning line.

11. A method of manufacturing the TFT LCD array substrate of claim 10 , the method comprising:

depositing a first metal film on the substrate and patterning the first metal film to form a gate scanning line;

depositing an insulating layer on the substrate;

applying a photoresist layer on the substrate and patterning the photoresist layer so that the photoresist is remained at the intersection of the gate scanning line and a signal scanning line to be formed;

depositing an active covering layer on the substrate and patterning the active covering layer so as to form an active layer partially covering the remained photoresist in a direction of the gate scanning line;

lifting off the remained photoresist between the insulating layer and the active layer, whereby an air gap is formed between the insulating layer and the active layer; and

depositing a second metal film on the substrate and patterning the second metal film to form the signal scanning line.

12. The method of claim 11 , wherein applying a photoresist layer on the substrate and patterning the photoresist layer comprises: in the direction perpendicular to the gate scanning ling, the width of the remained photoresist is larger than that of the gate scanning layer.

13. The method of claim 11 , wherein depositing an active covering layer on the substrate and patterning the active covering layer comprises:

in the direction of the gate scanning line, the width of the active layer is less than that of the remained photoresist.

14. A thin film transistor liquid crystal display (TFT LCD) array substrate, comprising:

a substrate,

a gate scanning line and a signal scanning line formed on the substrate and intersecting each other, and

an insulating layer and an active layer formed at the intersection of the gate scanning line and the signal scanning line between the gate scanning line and the signal scanning line,

wherein an air gap is formed between the insulating layer and the active layer at the intersection of the gate scanning line and the signal scanning line, and wherein the gate scanning line and the signal scanning line intersect at the position where the air gap is formed and both the gate scanning line and the signal scanning line extend across the air gap.

15. The TFT LCD array substrate of claim 14 , wherein the width of the air gap is equal to the width of the active layer in the direction of the gate scanning line.

16. The TFT LCD array substrate of claim 14 , wherein the width of the air gap is equal to the width of the gate scanning line in the direction of the signal scanning line.

17. A thin film transistor liquid crystal display (TFT LCD) array substrate, comprising:

a substrate,

a gate scanning line and a signal scanning line formed on the substrate and intersecting each other, and

an insulating layer and an active layer formed at the intersection of the gate scanning line and the signal scanning line wherein at least a portion of the active layer is layered between the gate scanning line and the signal scanning line,

wherein:

an air gap is formed between the insulating layer and the active layer at the intersection of the gate scanning line and the signal scanning line; and

the width of the air gap is equal to the width of the gate scanning line in the direction of the signal scanning line.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
To: BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO. LTD
Reel/Frame 036644/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2008
From: GUO, JIAN; WANG, WEI; KIM, KIYONG
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 020992/0541 →
Priority Claims (1)
CN 2007 1 0119563 · Jul 26, 2007 · national
Continuity (1)
Related Publication 20090027604A1 · Jan 29, 2009