Layer sequence and method of manufacturing a layer sequence
View Patent ↗A layer sequence ( 400 ), comprising an aluminum layer ( 300 ), a nickel layer ( 301 ), and a nickel layer protection layer ( 302; 701 ). The aluminum layer ( 300 ) is formable on a substrate ( 200 ), the nickel layer ( 301 ) is formed on the aluminum layer ( 300 ), and the nickel layer protection layer ( 302; 701 ) is formed on the nickel layer ( 301 ).
1. A method of manufacturing a layer sequence of an under bump metallurgic structure, the method comprising:
forming an aluminum layer on a bonding pad of a substrate, the aluminum layer forming an adhesion layer of the under bump metallurgic structure;
forming a nickel layer on the aluminum layer, the nickel layer forming a barrier layer of the under bump metallurgic structure, the nickel layer completely covering the aluminum layer;
forming a nickel layer protection layer on the nickel layer, the nickel layer protection layer preventing the nickel layer from being oxidized during the manufacturing of the layer sequence, the nickel layer protection layer completely covering the nickel layer;
after the step of forming the nickel layer protection layer, removing parts of the nickel layer protection layer to expose parts of the nickel layer; and
after the step of removing parts of the nickel layer protection layer, forming a solder material on the exposed parts of the nickel layer, wherein the solder material is brought in direct contact with the exposed parts of the nickel layer.
2. The method of claim 1 , wherein the nickel layer protection layer is a titanium layer.
3. The method of claim 1 further including the step of forming a passivation layer on the nickel layer protection layer.
4. The method of claim 1 , being integrated in the process of manufacturing an integrated circuit in the substrate.
5. The method of claim 3 , wherein the nickel layer protection layer prevents the nickel layer from being oxidized during the manufacture of the passivation layer.