Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
View Patent ↗A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.
1. An LED board comprising:
a wiring; and
at least one projection having a structure in which the surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film,
wherein a bottom surface of the elastic body is formed directly on the wiring,
wherein at least a portion of the elastic body is elastically deformed, and
wherein a portion of the projection is surrounded by a curable adhesive layer.
2. The LED board according to claim 1 , wherein
the projection is arranged on the wiring in a state in which the wiring and conductive film are conducted to each other.
3. The board according to claim 1 , wherein
wiring is arranged on the board, and the projecting section is arranged between the wiring and the board so as to be coated with the wiring, and a part laid over the projecting section of the wiring constitutes the conductive film.
4. A mounting structure comprising at least one device being mounted on an LED board including a wiring and at least one projection, the device including at least one bump, the projection having a structure in which the surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film,
wherein at least a tip part of the projection is buried in the bump,
wherein a bottom surface of the elastic body is formed directly on the wiring,
wherein at least a portion of the elastic body is elastically deformed, and
wherein a portion of the projection is surrounded by a curable adhesive layer.
5. An electronic device comprising one or a plurality of devices on an LED board,
wherein at least one of the devices includes at least one bump,
the board includes a wiring and at least one projection having a structure in which the surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film,
wherein at least a tip part of the projection is buried in the bump,
wherein a bottom surface of the elastic body is formed directly on the wiring,
wherein at least a portion of the elastic body is elastically deformed, and
wherein a portion of the projection is surrounded by a curable adhesive layer.
6. The LED board according to claim 1 , wherein the entire bottom surface of the elastic body is formed directly on the wiring.
7. The mounting structure according to claim 4 , wherein a part of the bump is surrounded by the curable adhesive layer.
8. The electronic device according to claim 5 , wherein a part of the bump is surrounded by the curable adhesive layer.