Method of manufacturing a junction barrier Schottky diode with dual silicides
An integrated circuit, including a junction barrier Schottky diode, has an N type well, a P-type anode region in the surface of the well, and an N-type Schottky region in the surface of the well and horizontally abutting the anode region. A first silicide layer is on and makes a Schottky contact to the Schottky region and is on an adjoining anode region. A second silicide layer of a different material than the first silicide is on the anode region. An ohmic contact is made to the second silicide on the anode region and to the well.
1. A method of manufacturing an integrated circuit including a junction barrier Schottky diode, the method including:
forming a P-type anode region in a surface of an N-type well;
forming a first mask with an opening exposing an N-type Schottky region of the surface of the well and adjoining portion of the anode region;
applying a first material and forming a first silicide layer of the first material with the exposed portions of the Schottky and anode regions;
forming a second mask with an opening exposing a portion of the anode region not having the first silicide layer;
applying a second material different from the first material and forming a second silicide layer of the second material with the exposed portion of the anode region; and
forming an ohmic contact to the second silicide layer on the anode region, and an ohmic contact to the well wherein the first and second silicide layers are formed spaced entirely from each other on the surface.
2. The method of claim 1 , includes forming an N-type cathode contact region in the surface having a higher impurity concentration than the Schottky region's impurity concentration, and the ohmic contact to the well is to the cathode contact region.
3. The method of claim 2 , wherein the well includes an N-type buried layer having a higher impurity concentration than the well's impurity concentration, and including forming the N-type cathode contact region extending from the surface to buried layer.
4. The method of claim 2 , includes forming a portion of the second silicide on the cathode contact region on a portion of the cathode contact region, and the ohmic contact to the well is formed to the second silicide layer on the cathode contact region.
5. The method of claim 1 , wherein the first material is Cobalt and the second material is Titanium.
6. The material of claim 1 , wherein the first material is Titanium and the second material is Platinum.