Method of manufacturing a piezoelectric vibrating piece
To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 40 and forming outer shapes of a plurality of piezoelectric plates 10 simultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and in the electrode forming step and the cutting step, positioning to the wafer is carried out by constituting the reference point by the center of the through hole.
1. A method of fabricating a plurality of piezoelectric vibrating pieces each including a piezoelectric plate made of a piezoelectric material, and an electrode formed on an outer surface of the piezoelectric plate for vibrating the piezoelectric plate when a predetermined voltage is applied thereto at a time utilizing a wafer, the method comprising:
an outer shape forming step of forming two or more of through holes penetrating the wafer and forming outer shapes of the plurality of piezoelectric plates at the wafer by constituting reference points by centers of the through holes by etching the wafer by a photolithography technology;
a wafer setting step of preparing a jig for the wafer having a flat plate portion and inserting pins formed by a number the same as a number of the through holes to project from above the flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pins into the through holes;
an electrode forming step of forming an electrode by patterning the electrode film on the outer surfaces of the plurality of piezoelectric plates; and
a cutting step of cutting to separate the plurality of piezoelectric plates on the wafer to fragment;
wherein in the electrode forming step and the cutting step, positioning to the wafer is carried out by constituting at least one of the reference points by the center of the through hole.
2. The method of fabricating a piezoelectric vibrating piece according to claim 1 , wherein in the outer shape forming step, the through hole is formed such that a corner portion thereof is constituted by a smooth curve when the wafer is viewed planely.
3. The method of fabricating a piezoelectric vibrating piece according to claim 1 , wherein in the outer shape forming step, the through hole is formed to constitute a circular shape when the wafer is viewed planely.