IP Library Granted Patent US 8,110,146
Granted Patent B2
US 8,110,146 · App. 12/275,610 · Granted Feb 7, 2012

Embedded block humidifier, automatic thin slice manufacturing device, and automatic thin slice specimen manufacturing apparatus

Assignee: Seiko Instruments Inc.
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Quick Facts
Patent No.
US 8,110,146
App. No.
12/275,610
Granted
Feb 7, 2012
Kind
B2
Abstract

An embedded block is capable of being humidified in a short time without influencing a surface temperature of the embedded block as much as possible. An embedded block humidifier for humidifying an embedded block having a biological specimen embedded in an embedding agent is provided which includes a vapor generating mechanism for generating vapor heated at a predetermined temperature and a guiding mechanism for guiding the vapor to the embedded block so that the generated vapor contacts with a surface of the embedded block set at a predetermined standby position.

Claims (36)

1. An embedded block humidifier for humidifying an embedded block having a biological specimen embedded in an embedding agent, the embedded block humidifier comprising:

a vapor generating mechanism generating vapor heated at a predetermined temperature;

a guiding mechanism guiding the vapor to the embedded block so that the generated vapor contacts with a surface of the embedded block set at a predetermined standby position;

a tank storing liquid;

a liquid heater heating the liquid;

a heater temperature controller controlling a temperature of the liquid heater;

a bubble generating mechanism provided with a pipe inserted into the tank to be submerged in the liquid and generating countless bubbles from the front end of the pipe by supplying air to the pipe; and

an air controller controlling an air supply amount.

2. The embedded block humidifier according to claim 1 , further comprising:

a sensor measuring a surface temperature of the embedded block,

wherein the heater temperature controller controls the temperature of the liquid heater so that a temperature of the generated vapor more increases than a temperature of the embedded block measured by the sensor by a predetermined temperature.

3. The embedded block humidifier according to claim 2 , wherein the air controller controls the air supply amount on the basis of the temperature of the embedded block measured by the sensor.

4. The embedded block humidifier according to claim 1 , wherein the guiding mechanism includes:

a guiding pipe guiding the vapor to the embedded block;

a guiding-pipe heater heating the guiding pipe; and

a guiding-pipe temperature controller controlling a temperature of the guiding-pipe heater.

5. The embedded block humidifier according to claim 1 , wherein the guiding mechanism includes:

an accumulating part temporarily accumulating the vapor; and

a discharging mechanism discharging the accumulated vapor to the outside of the accumulating part at a time, and

wherein the guiding mechanism guides the discharged vapor to the embedded block.

6. An automatic thin slice manufacturing device comprising:

the embedded block humidifier comprising:

a vapor generating mechanism generating vapor heated at a predetermined temperature; and

a guiding mechanism guiding the vapor to the embedded block so that the generated vapor contacts with a surface of the embedded block set at a predetermined standby position;

a fixed table placing and fixing the embedded block thereon;

a cutting mechanism provided with a cutting blade disposed at a position away from the standby position and cutting the embedded block by moving the fixed table between the standby position and the cutting blade so as to obtain a thin slice having a predetermined thickness; and

a thin slice carrying mechanism carrying the cut thin slice.

7. The automatic thin slice manufacturing device according to claim 6 , further comprising:

a position sensor determining whether the embedded block is located at the standby position; and

a controller operating the vapor generating mechanism when the position sensor determines that the embedded block is located at the standby position.

8. The automatic thin slice manufacturing device according to claim 6 , wherein the cutting mechanism moves the fixed table after a predetermined elapsed time from a time point when the vapor generating mechanism is operated.

9. An automatic thin slice specimen manufacturing apparatus comprising:

the automatic thin slice manufacturing device according to claim 6 ;

a block carrying mechanism carrying the embedded block onto the fixed table;

an extending mechanism extending the thin slice carried by the thin slice carrying mechanism by floating the thin slice on at least liquid; and

a transferring mechanism manufacturing a thin slice specimen by transferring the extended thin slice onto a substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2012
From: SEIKO INSTRUMENTS INC.
To: SAKURA FINETEK JAPAN CO., LTD.
Reel/Frame 028119/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2009
From: ITO, TETSUMASA; KIJIMA, YUKIMITSU; FUJIMOTO, KOJI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 022219/0840 →
Priority Claims (2)
JP 2007-306353 · Nov 27, 2007 · national
JP 2008-214344 · Aug 22, 2008 · national
Continuity (1)
Related Publication 20090137028A1 · May 28, 2009