Light emitting device and method of manufacturing the same
A light emitting device is provided. The light emitting device comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, and an InNO layer. The active layer is disposed on the first conductive semiconductor layer. The second conductive semiconductor layer is disposed on the active layer. The InNO layer is disposed on the second conductive semiconductor layer.
1. A light emitting device comprising:
a first conductive semiconductor layer comprising N-type impurities;
an active layer on the first conductive semiconductor layer;
a second conductive semiconductor layer comprising P-type impurities on the active layer;
an In rich InGaN layer on the second conductive semiconductor layer;
an In rich InGaNO layer on the In rich InGaN layer; and
a first electrode layer on the first conductive semiconductor layer and a second electrode layer on the In rich InGaNO layer,
wherein the In rich InGaNO layer is an oxide layer of an upper portion of the In rich InGaN layer, and
wherein the In rich InGaN layer is an In x Ga 1−x N (0.7≦x<1) layer, and the In rich InGaNO layer in an In x Ga 1−x NO (0.7≦x<1) layer.
2. The light emitting device according to claim 1 , comprising a third conductive semiconductor layer between the second conductive semiconductor layer and the In rich InGaNO layer, the third conductive semiconductor layer comprising N-type impurities.
3. The light emitting device according to claim 1 , comprising an ITO layer on the In rich InGaNO layer.
4. The light emitting device according to claim 1 , wherein the In rich InGaNO layer comprises N-type impurities.
5. The light emitting device according to claim 1 , wherein a thickness of the In rich InGaNO layer is about 1 nm to about 100 nm.