IP Library Granted Patent US 8,111,553
Granted Patent B2
US 8,111,553 · App. 12/662,431 · Granted Feb 7, 2012

Non-volatile semiconductor memory device in which program disturb is reduced and method of programming the same

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,111,553
App. No.
12/662,431
Granted
Feb 7, 2012
Kind
B2
Abstract

A non-volatile semiconductor memory device capable of reducing program disturb and a method of programming the same are provided. A bit line connected to a non-selected memory cell in the same block as a selected memory cell enters a floating state by inactivating a bit line selection switch, so that voltage levels of an first conductivity type channel and a source/drain terminal formed in a pocket second conductivity type well below a memory transistor have an intermediate level of a voltage level of a selection line and the pocket P type well. Therefore, program disturb caused by FN tunneling and junction hot electrons can be inhibited.

Claims (35)

1. A non-volatile semiconductor memory device, comprising:

at least one memory cell block including a plurality of memory cells, each memory cell including a memory transistor and a selection transistor serially connected between a plurality of bit lines and a common source line, the memory transistor and the selection transistor having gates respectively connected to a plurality of selection lines and a plurality of word lines disposed in a direction perpendicular to the bit lines;

a bit line selection switch block including a plurality of bit line selection switches configured to electrically connect the bit lines with corresponding global bit lines in response to voltages applied to a plurality of bit line selection switch lines, respectively; and

a controller configured to decode an address applied externally at the time of a program operation, control the voltage applied to the bit line selection switch line, and electrically disconnect a bit line that is not selected from the global bit line to float the bit line that is not selected.

2. The non-volatile semiconductor memory device as claimed in claim 1 , further comprising:

a first conductive type substrate;

a second conductive type deep well formed in a predetermined area within the substrate; and

a first conductive type pocket well formed in a predetermined area within the deep well,

wherein the memory cell block and the bit line selection switch block are formed in the pocket well.

3. The non-volatile semiconductor memory device as claimed in claim 2 , wherein, at the time of the program operation, when the decoded address selects the memory cell block, the controller is configured to:

apply a first negative voltage to the word lines and a second negative voltage to the pocket well;

float the common source line;

decode a row address of the address; and

apply a first positive voltage to the selection line which is selected and a ground voltage to the selection line which is not selected.

4. The non-volatile semiconductor memory device as claimed in claim 3 , wherein when data applied from the outside is 1, a third negative voltage is applied to the global bit line.

5. The non-volatile semiconductor memory device as claimed in claim 4 , wherein, at the time of the program operation, the controller is configured to:

decode a column address of the address;

apply a second positive voltage to a bit line selection switch line that is selected; and

apply a fourth negative voltage to a bit line selection switch line that is not selected.

6. The non-volatile semiconductor memory device as claimed in claim 5 , wherein the first positive voltage has a voltage level with a larger absolute value than the first to fourth negative voltages, the second positive voltage has a voltage level with a smaller absolute value than the first to third negative voltages, and the fourth negative voltage has a voltage level with a smaller absolute value than the second positive voltage.

7. A method of programming a non-volatile semiconductor memory device which includes at least one memory cell block including a plurality of memory cells, each memory cell including a memory transistor and a selection transistor serially connected between a plurality of bit lines and a common source line, the memory transistor and the selection transistor having gates respectively connected to a plurality of selection lines and a plurality of word lines disposed in a direction perpendicular to the bit lines, and a bit line selection switch block, including a plurality of bit line selection switches configured to electrically connect the bit lines with corresponding global bit lines in response to voltages applied to a plurality of bit line selection switch lines, respectively, the method comprising, at the time of a program operation:

decoding an address applied externally;

controlling the voltage applied to the bit line selection switch line; and

electrically disconnecting a bit line that is not selected from the global bit line to float the bit line that is not selected.

8. The method as claimed in claim 7 , further comprising, at the time of the program operation, when the decoded address selects the memory cell block:

applying a first negative voltage to the word lines;

applying a second negative voltage to a pocket well in which the memory cell block and the bit line selection switch block are formed; and

floating the common source line.

9. The method as claimed in claim 8 , further comprising, at the time of the program operation:

decoding a row address of the address;

applying a first positive voltage having a voltage level having a larger absolute value than the first and second negative voltages to the selection line which is selected and a ground voltage to the selection line which is not selected; and

when data applied from the outside is 1, applying a third negative voltage having a voltage level having a smaller absolute value than the first positive voltage to the corresponding global bit line.

10. The method as claimed in claim 9 , wherein floating the bit line comprises

decoding a column address of the address; and

applying a second positive voltage, having a voltage level having a smaller absolute value than the first to third negative voltages, to a bit line selection switch line that is selected and a fourth negative voltage, having a voltage level which is smaller in absolute value than the second positive voltage, to a bit line selection switch line that is not selected.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2010
From: SEO, BO-YOUNG; JEON, HEE-SEOG; KIM, KWANG-TAE; PARK, JI-HOON; CHUN, MYUNG-JO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 024284/0710 →
Priority Claims (1)
KR 10-2009-0034273 · Apr 20, 2009 · national
Continuity (1)
Related Publication 20100265765A1 · Oct 21, 2010