IP Library Granted Patent US 8,115,230
Granted Patent B2
US 8,115,230 · App. 12/940,718 · Granted Feb 14, 2012

Light emitting device, light emitting device package and lighting system

Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,115,230
App. No.
12/940,718
Granted
Feb 14, 2012
Kind
B2
Abstract

Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes an oxide including gallium aluminum over a gallium oxide substrate, a nitride including gallium aluminum over the oxide including gallium aluminum, and a light emitting structure over the nitride including gallium aluminum.

Claims (19)

1. A light emitting device comprising:

an oxide including gallium aluminum over a gallium oxide substrate;

a nitride including gallium aluminum over the oxide including gallium aluminum; and

a light emitting structure over the nitride including gallium aluminum.

2. The light emitting device of claim 1 , wherein the oxide including gallium aluminum comprises Ga x Al y O z (0<x≦1, 0<y≦1, 0<z≦1).

3. The light emitting device of claim 1 , wherein the oxide including gallium aluminum has a thickness of 1 or less.

4. The light emitting device of claim 1 , wherein the nitride including gallium aluminum comprises Ga x Al y N z (0<x≦1, 0<y≦1, 0<z≦1).

5. The light emitting device of claim 1 , wherein the light emitting structure comprises:

a second conductive semiconductor layer over the nitride including gallium aluminum;

an active layer over the second conductive semiconductor layer; and

a first conductive semiconductor layer over the active layer.

6. A light emitting device package comprising:

a package body;

third and fourth electrode layers over the package body; and

a light emitting device claimed in claim 1 and electrically connected to the third and fourth electrode layers.

7. A lighting system comprising:

a substrate; and

a light emitting module including a light emitting device package over the substrate,

wherein the light emitting device package comprises a package body, third and fourth electrode layers over the package body, and a lighting emitting device claimed in claim 1 and electrically connected to the third and fourth electrode layers.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2022
From: KOHA CO., LTD.
To: TAMURA CORPORATION
Reel/Frame 058547/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2014
From: LG INNOTEK CO., LTD.
To: KOHA CO., LTD.; LG INNOTEK CO., LTD.; TAMURA CORPORATION
Reel/Frame 033711/0110 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2010
From: MOON, YONG TAE
To: LG INNOTEK CO., LTD.
Reel/Frame 025322/0493 →
Priority Claims (1)
KR 10-2009-0127189 · Dec 18, 2009 · national
Continuity (1)
Related Publication 20110147771A1 · Jun 23, 2011