Method for packaging components

1. Method for the manufacture of packaged components, the method comprising:

mounting a plate-like cover substrate on a carrier substrate;

inserting trenches on the uncovered side of the plate-like cover substrate, which divide the plate-like cover substrate, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, or interconnected by the carrier substrate;

connecting the covering parts of the composite parts to a functional substrate with a plurality of components, so that the trenches run along isolation areas on the functional substrate between functional areas of the components, and the covering parts cover the functional areas;

eliminating the connection of the covering parts; and

removing the carrier substrate, thus obtaining a composite with the functional substrate and a plurality of covering parts that cover functional areas.

2. Method according to claim 1 , in which the trenches are inserted in such a way that in each case the covering parts present, in at least one direction along the side of the functional substrate, on which side the covering parts are applied, a smaller dimension than the area between two isolation areas.

3. Method according to claim 1 , in which, during the application of the covering parts, cavities are defined that surround the functional areas.

4. Method according to claim 3 , further comprising:

on the plate-like cover substrate, applying a structured intermediate layer, which is structured so that framed-shaped areas of the cover substrate remain uncovered;

depositing a coating on the side of the cover substrate that is provided with the intermediate layer;

removing the intermediate layer, where the areas of the coating, which are deposited on the intermediate layer, are removed together with the intermediate layer, and raised, frame-shaped structures are obtained on the frame-shaped areas that are left uncovered by the intermediate layer, and where, on the uncovered side of the plate-like cover substrate, the trenches, which divide the plate-like cover substrate, are inserted in such a way that they run between the frame-shaped structures; and

connecting, on the frame-shaped structures, the covering parts that are mounted to the carrier substrate with the functional substrate so that cavities are defined, which are delimited by the frame-shaped structures, and enclose the functional areas.

5. Method according to claim 4 , characterized in that the coating for the preparation of the frame-shaped structures is deposited by vapor deposition of glass.

6. Method according to claim 4 , characterized in that a photoresist layer is applied as intermediate layer and structured photolithographically.

7. Method according to claim 4 , characterized in that frame-shaped structures are prepared that present a gap, so that after removal of the covering parts and the removal of the carrier substrate, channels are formed by the gaps, and connect the environment with the cavity.

8. Method according to claim 7 , characterized in that the channels are closed, particularly after additional process steps that are carried out in vacuum.

9. Method according to claim 3 , characterized in that protective gas is enclosed in the cavities.

10. Method according to claim 3 , characterized in that the coating is deposited at a layer thickness that is smaller than the thickness of a structured intermediate layer.

11. Method according to claim 1 , characterized in that a glass cover substrate is used.

12. Method according to claim 1 , characterized in that the covering parts are separated from each other by pairs of parallel trenches.

13. Method according to claim 1 , characterized in that the covering parts are fixed on the functional substrate for the mounting.

14. Method according to claim 13 , characterized in that the covering parts are fixed on the functional substrate with a UV-curable adhesive.

15. Method according to claim 1 , characterized in that the cover substrate is fixed on the carrier substrate by means of a UV-removable adhesive, and the adhesive is irradiated with UV light for the detachment of the carrier substrate from the cover substrate.

16. Method according to claim 1 , characterized in that the cover substrate is mounted on a glass carrier substrate.

17. Method according to claim 1 , characterized in that the trenches are produced by mechanical ablation.

18. Method according to claim 1 , characterized in that trenches are inserted that extend partially into the carrier substrate.

19. Method according to claim 1 , characterized in that the components present electrical connection sites on the side with the functional areas, where the covering parts are detached by trenches and applied on the functional substrate, so that the electrical connection sites are uncovered.

20. Method according to claim 1 , characterized in that the individual components are prepared by separating the functional substrate along the isolation areas between the functional areas.

21. Method according to claim 1 , in which electronic, optoelectronic or microelectromechanical components on a wafer are encapsulated with the covering parts.

22. Method according to claim 1 , characterized in that the covering parts form optical windows for the functional areas.