High-frequency device and high-frequency circuit used therein

1. A high-frequency device having a high-frequency circuit comprising a high-frequency amplifier, and an output-matching circuit receiving high-frequency power output from said high-frequency amplifier, formed in and on a multilayer substrate obtained by laminating pluralities of dielectric layers, said output-matching circuit comprising:

a first transmission line which transmits said high-frequency power from the high-frequency amplifier side to the output terminal side; and

at least one resonance circuit branch-connected from said first transmission line to ground,

wherein at least a part of said first transmission line is formed by conductor patterns formed on at least three adjacent dielectric layers in said multilayer substrate.

2. The high-frequency device according to claim 1 , wherein pluralities of said conductor patterns are spirally connected with a lamination direction as a center axis.

3. The high-frequency device according to claim 2 , wherein pluralities of said conductor patterns are connected through via-electrodes, and wherein among pluralities of said conductor patterns, those formed on adjacent dielectric layers are opposing in a lamination direction only in portions connected through said via-electrode.

4. The high-frequency device according to claim 1 , wherein a portion of said first transmission line, which is constituted by pluralities of conductor patterns formed on pluralities of dielectric layers, has a first end on the high-frequency amplifier side and a second end on the output terminal side, said first end being connected to said high-frequency amplifier through a via-electrode, and said second end being located at a lamination direction position closer to or more distant from said high-frequency amplifier than said first end.

5. The high-frequency device according to claim 4 , wherein a ground electrode is disposed at a lamination direction position closer to the first end than the second end of said first transmission line, or at a lamination direction position closer to the second end than the first end of said first transmission line.

6. The high-frequency device according to claim 5 , wherein in at least part of adjacent dielectric layers, a conductor pattern formed on a dielectric layer closer to said ground electrode is wider than a conductor pattern formed on a dielectric layer more distant from said ground electrode.

7. A high-frequency device having a high-frequency circuit comprising a high-frequency amplifier, and an output-matching circuit receiving high-frequency power output from said high-frequency amplifier, in and on a multilayer substrate obtained by laminating pluralities of dielectric layers, said output-matching circuit comprising:

a first transmission line which transmits said high-frequency power from the high-frequency amplifier side to the output terminal side; and

at least one resonance circuit branch-connected to said first transmission line,

wherein at least a part of said first transmission line being constituted by conductor patterns formed on dielectric layers in said multilayer substrate, and

said resonance circuit is a series resonance circuit constituted by a first capacitor and a second transmission line.

8. The high-frequency device according to claim 7 , wherein the resonance frequency of said resonance circuit is adjusted such that it is substantially equal to at least one frequency of the n-th harmonics of said high-frequency power, wherein n is a natural number of 2 or more.

9. The high-frequency device according to claim 7 , which comprises a parallel resonance circuit constituted by a third transmission line series-connected to said first transmission line, and a second capacitor parallel-connected to said third transmission line.

10. The high-frequency device according to claim 9 , which further comprises a fourth transmission line and a third capacitor, one end of said fourth transmission line being connected to an output-terminal-side end of said third transmission line, the other end of said fourth transmission line being connected to an output-terminal-side end of said second capacitor, one end of said third capacitor being connected to the other end of said fourth transmission line, and the other end of said third capacitor being grounded.