Opto-electric hybrid board and manufacturing method thereof
An opto-electric hybrid board in which a new alignment mark having an identifying mark that is easy to recognize is formed in addition to a conventional alignment mark, and a method of manufacturing the opto-electric hybrid board. The opto-electric hybrid board includes an optical waveguide portion 2 , an electric circuit board 1 , and optical elements mounted on this electric circuit board 1 . The optical waveguide portion 2 includes a translucent under cladding layer 21 , a linear core 22 for an optical path, first alignment marks 24 positioned relative to end portions of this core 22 , and an over cladding layer 23 for covering the above-mentioned core 22 and the first alignment marks 24 . The electric circuit board 1 includes second alignment marks 15 for positioning of the optical elements and formed on a surface thereof on which the optical elements are mounted.
1. An opto-electric hybrid board comprising:
an optical waveguide portion;
an electric circuit portion; and
an optical element mounted on the electric circuit portion,
said optical waveguide portion including
a translucent under cladding layer,
a linear core for an optical path formed on a surface of the under cladding layer,
a first alignment mark formed on the surface of the under cladding layer and positioned relative to an end portion of the core, and
an over cladding layer formed on the surface of the under cladding layer and for covering said core and the first alignment mark,
said electric circuit portion including
a second alignment mark for positioning of the optical element and formed on a surface of said electric circuit portion on which the optical element is mounted, said second alignment mark having a surface covered with a resin layer, except for an uncovered portion for identification, wherein the uncovered portion is provided by using said first alignment mark as a reference.
2. The opto-electric hybrid board according to claim 1 , wherein said second alignment mark is made of metal for an electric circuit.
3. A method of manufacturing an opto-electric hybrid board, comprising the steps of:
(a) producing an electric circuit portion;
(b) producing an optical waveguide portion;
(c) mounting an optical element on the electric circuit portion,
said step (b) including the steps of
(b-1) forming a translucent under cladding layer,
(b-2) forming a linear core for an optical path and a first alignment mark on a surface of the under cladding layer and positioned relative to an end portion of the core, and
(b-3) forming an over cladding layer on the surface of the under cladding layer so as to cover the core and the first alignment mark,
said step (a) including the steps of
(a-1) forming an electric circuit and a second alignment mark for positioning of the optical element on a substrate, and
(a-2) covering a surface of the second alignment mark with a resin layer, except for an uncovered portion for identification, by using the first alignment mark as a reference,
wherein the mounting of the optical element in said step (c) is achieved by using the uncovered portion for identification of the second alignment mark as a reference.
4. The method of manufacturing the opto-electric hybrid board according to claim 3 , wherein said second alignment mark is formed using metal for the electric circuit.