IP Library Granted Patent US 8,158,031
Granted Patent B2
US 8,158,031 · App. 12/437,634 · Granted Apr 17, 2012

Method for preparing metal nanoparticles using metal seed and metal nanoparticles comprising metal seed

Assignee: Samsung Electro-Mechanics Co., Ltd.
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Quick Facts
Patent No.
US 8,158,031
App. No.
12/437,634
Granted
Apr 17, 2012
Kind
B2
Abstract

It provides a method for preparing metal nanoparticles using a metal seed and metal nanoparticles including the metal seed, the method including: preparing a solution by adding a polymer surfactant in an alcohol solvent; heating the solution; forming a metal seed by adding a first metal salt of at least one metal salt selected from the group consisting of platinum, palladium and iridium in the heated solution; and adding a second metal salt into the solution including the metal seed. This method allows the production of uniform-sized nanoparticles under high concentration conditions in high yield and mass production in which the metal nanoparticles have high dispersion stability so that they are suitable for various application.

Claims (11)

1. A method for manufacturing metal nanoparticles comprising:

preparing a solution by adding a polymer surfactant in an alcohol solvent;

heating the solution at a temperature of 100° C. to a boiling temperature of the solution;

forming a metal seed by adding a first metal salt of at least one metal salt selected from the group consisting of platinum, palladium and iridium in the heated solution; and

adding a second metal salt into the solution including the metal seed,

wherein the polymer surfactant is added by 1 to 100 equivalents with respect to 1 equivalent of the second metal salt to be added and the first metal salt forming the metal seed is added by 1 to 1/1000 equivalents with respect to 1 equivalent of the second metal salt to be added.

2. The method of claim 1 , wherein the polymer surfactant is polyvinylpyrrolidone or a copolymer comprising polyvinylpyrrolidone.

3. The method of claim 1 , wherein the first metal salt forming the metal seed is at least one metal salt selected from the group consisting of chloroplatinic acid (H 2 PtCl 6 ), platinum chloride (PtCl 4 ), potassium hexachloroplatinate (K 2 PtCl 6 ), sodium hexachloroplatinate (Na 2 PtCl 6 ), palladium chloride (PdCl2), palladium iodide (PdI 2 ), palladium bromide (PdBr 2 ), palladium nitrate (Pd(NO 3 ) 2 ), palladium sulfate (PdSO 4 ), palladium(II) acetylacetonate, palladium(II) trifluoroacetate, iridium(III) chloride, iridium(III) acetylacetonate and iridium(III) bromide.

4. The method of claim 1 , wherein the second metal salt is a salt of one metal selected from the group consisting of gold, silver, copper and palladium.

5. The method of claim 1 , wherein the second metal salt is at least one metal salt selected from the group consisting of chloroauric acid (HAuCl 4 ), bromoauric acid (HAuBr 4 ), potassium tetrachloroaurate (KAuCl 4 ) and sodium tetrachloroaurate (NaAuCl 4 ), silver nitrate (AgNO 3 ), silver acetate (AgCH 3 CO 2 ), silver acetylacetonate, copper(II) chloride (CuCl 2 ), copper(II) nitrate (Cu(NO 3 ) 2 ), copper(II) sulfate (CuSO 4 ), palladium chloride (PdCl 2 ), palladium iodide (PdI 2 ), palladium bromide (PdBr 2 ), palladium nitrate (Pd(NO 3 ) 2 ), palladium sulfate (PdSO 4 ), palladium(II) acetylacetonate and palladium(II) trifluoroacetate.

6. The method of claim 1 , wherein the alcohol solvent is at least one selected from the group consisting of diethylene glycol, 1,5-pentanediol, tetraethylene glycol, ethylene glycol and triethylene glycol.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2009
From: LEE, KWI-JONG; SONG, HYUN-JOO; SEO, DAE-HA; JUNG, JONG-WOOK; KIM, DONG-HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022656/0052 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2009
From: LEE, KWI-JONG; SONG, HYUN-JOO; SEO, DAE-HA; JUNG, JONG-WOOK; KIM, DONG-HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022656/0223 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT SERIAL NUMBER 12370818 PREVIOUSLY RECORDED ON REEL 022656 FRAME 0052. ASSIGNOR(S) HEREBY CONFIRMS THE AN ASSIGNMENT. Recorded May 8, 2009
From: LEE, KWI-JONG; SONG, HYUN-JOO; SEO, DAE-HA; JUNG, JONG-WOOK; KIM, DONG-HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022660/0742 →
Priority Claims (1)
KR 10-2008-0094272 · Sep 25, 2008 · national
Continuity (1)
Related Publication 20100072434A1 · Mar 25, 2010