PTC device
There is provided a PTC device which allows compact connection as much as possible. Such PTC device includes a polymer PTC element ( 102 ) including (A) a polymer PTC component ( 112 ) an electrically conductive filler, and a polymer material; and (B) a metal electrode ( 104 ) placed on at least one surface of the polymer PTC component. Also present are a lead ( 106 ) of which at least a part is positioned on the metal electrode of the PTC element; a protective coating ( 108 ) which surrounds an exposed area of the PTC element, and a hardened solder paste which is present as a connection area ( 110 ) which electrically connects the metal electrode and said at least a part of the lead.
1. A PTC device, comprising:
(1) a PTC element comprising:
(A) a polymer PTC component comprising:
(a) an electrically conductive filler, and
(b) a polymer material; and
(B) a metal electrode placed on at least one surface of the polymer PTC component;
(2) a lead of which at least a part is positioned on the metal electrode of the PTC element; and
(3) a protective coating which surrounds an exposed area of the PTC element,
characterized by a hardened solder paste electrically connecting the metal electrode and said at least a part of the lead, said solder paste comprising a hardening resin and solder powder.
2. The PTC device according to claim 1 , wherein the lead is placed in its entirety on the metal electrode.
3. The PTC device according to claim 1 , wherein the solder paste comprises a thermosetting resin and solder particles.
4. The PTC device according to claim 1 , wherein the hardening resin is an epoxy resin.
5. The PTC device according to claim 1 , wherein the conductive filler is Ni filler or Ni alloy filler.
6. The PTC device according to claim 5 , wherein the Ni alloy is a Ni—Co alloy.
7. The PTC device according claim 1 , wherein the lead is a Ni lead.
8. The PTC device according to claim 1 , wherein the protective coating is formed of a hardened thermosetting resin.
9. An electrical device comprising:
(I) a PTC device, comprising:
(1) a PTC element comprising:
(A) a polymer PTC component comprising:
(a) an electrically conductive filler, and
(b) a polymer material; and
(B) a metal electrode placed on at least one surface of the polymer PTC component;
(2) a lead of which at least a part is positioned on the metal electrode of the PTC element;
(3) a protective coating which surrounds an exposed area of the PTC element, and
(4) a hardened solder paste electrically connecting the metal electrode and said at least a part of the lead, said solder paste comprising a hardening resin and solder powder; and
(II) an electrical component electrically connected to said PTC device.
10. The electrical device according to claim 9 , wherein the PTC device and the electrical component are electrically connected by a connection means positioned between the lead of the PTC device and the electrical component which is positioned over the lead.
11. The electrical device according to claim 10 , wherein the connection means positioned between the lead of the PTC device and the electrical component is formed by heating a connection means precursor.
12. The electrical device according to claim 11 , wherein the connection means precursor is a solder material, a solder paste, or an electrically conductive paste positioned between the lead and the electrical component.
13. A PTC device according to claim 1 , wherein the conductive filler is composed of carbon black.
14. The electrical device according to claim 9 , wherein the electrical component is a wiring, a pad, or a land, a portion thereof, or an electrode of an electronic part.
15. The electrical device according to claim 9 , wherein the lead of the PTC device and the electrical component positioned over the lead are electrically connected directly by a weld.
16. A process for producing a PTC device, said PTC device comprising:
(1) a PTC element comprising:
(A) a polymer PTC component comprising:
(a) an electrically conductive filler, and
(b) a polymer material; and
(B) a metal electrode placed on at least one surface of the polymer PTC component;
(2) a lead of which at least a part is positioned on the metal electrode of the PTC element;
(3) a protective coating which surrounds an exposed area of the PTC element, and
(4) a solder paste comprising a hardening resin and solder powder;
said process comprising
supplying a solder paste on at least one metal electrode of the PTC element,
locating the lead on an amount of the solder paste,
hardening the solder paste so as to form a connection area which electrically connects the metal electrode and at least part of the lead, and
covering the exposed area of the PTC element with the protective coating.
17. The process according to claim 16 , wherein the protective coating covers the exposed area of the connection area in addition to the exposed area of the PTC element.