Process and apparatus for fabricating precise microstructures and polymeric molds for making same
There is disclosed a method and apparatus for producing a polymeric film that accurately replicates a complex mold surface at least a portion of which surface has microstructured or nano-structured dimensions. A polymeric powder is electrodeposited on an underlying mold surface. Then the powder is cured to create a polymeric film. Finally the film is removed from the mold surface.
1. Apparatus for continuously producing a web of film having a complex pattern of microstructured or nanostructured elements in at least a portion thereof, comprising:
(a) a mold having a first pattern of microstructured or nanostructured elements in a surface thereon;
(b) means for moving said mold along a continuous path;
(c) means disposed at at least one location along said path for depositing a first layer of polymeric thermoset or thermoplastic powder resin having a particle size smaller than said microstructured or nanostructured elements onto said moving mold surface;
(d) means disposed at at least one location along said path for melting said deposited polymeric powder;
(e) optionally, means disposed at at least one location along said path for effecting a cure of said melted deposited polymeric powder whereby said melted and optionally cured polymeric powder will form a film having the desired microstructured or nanostructured pattern thereon; and
(f) means for receiving said film having a microstructured or nanostructured surface on at least one side thereof from said moving surface of said mold;
wherein said apparatus is operable such that said deposited powder does not completely fill the microstructured pattern on said mold surface, said apparatus further comprising
means disposed along said path after said melting means for pressing a polymer sheet onto said deposited polymer to press said deposited polymer into said pattern to a level less than the full depth of said microstructures,
whereby when said deposited polymer forms a film and said polymer sheet is removed from said film, said film will have vias formed therethrough.
2. The apparatus of claim 1 wherein at least some of said microstructured or nanostructured elements of said pattern are configured such that the vias formed in said film by said elements have a bottom perimeter in one surface of said film that is larger than the top perimeter formed in the opposite surface of said film.
3. Apparatus for continuously producing a web of film having a complex pattern of microstructured or nanostructured elements in at least a portion thereof, comprising:
(a) a mold having a first microstructured or nanostructured pattern in a surface thereon;
(b) means for moving said mold along a continuous path at least a portion of which is substantially planar;
(c) first depositing means disposed at at least one location along said path for depositing a first layer of polymeric having a particle size smaller than said microstructured or nanostructured elements onto said moving mold surface;
(d) first melting means disposed at at least one location along said path for melting said first layer of deposited polymeric powder, such that said melted polymer layer forms a film having said first microstructured or nanostructured pattern formed in a surface thereof;
wherein said apparatus is operable such that said deposited powder does not completely fill the microstructured pattern on said mold surface, said apparatus further comprising means disposed along said path after said melting means for pressing a polymer sheet onto said deposited polymer to press said polymer into said pattern to a level less than the full depth of said microstructures, whereby when said polymer forms a film and said polymer sheet is removed from said film, said film will have vias formed therethrough.
4. The apparatus of claim 3 further comprising means for curing said melted polymer, said curing means disposed along said path after said means for pressing a polymer sheet onto said melted polymer.
5. The apparatus of claim 3 wherein said microstructured or nanostructured pattern comprises at least some elements configured such that the vias formed by said elements in said film have a bottom perimeter in one surface of said film that is larger than the top perimeter formed in the opposite surface of said film.